-
公开(公告)号：US11828549B2
公开(公告)日：2023-11-28
申请号：US16555711
申请日：2019-08-29
Applicant: NVIDIA CORPORATION
Inventor： Susheela Narasimhan , Sanjay Choudhry
CPC classification number: F28F3/086 , F28D1/0475 , F28D15/02 , F28D15/0275 , H05K7/20 , F28D2021/0029 , F28F2215/04
Abstract: An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.
-
公开(公告)号：US20200217599A1
公开(公告)日：2020-07-09
申请号：US16555711
申请日：2019-08-29
Applicant: NVIDIA CORPORATION
Inventor： Susheela Narasimhan , Sanjay Choudhry
Abstract: An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.
-
公开(公告)号：US12150284B2
公开(公告)日：2024-11-19
申请号：US17704678
申请日：2022-03-25
Applicant: Nvidia Corporation
Inventor： Susheela Nanjunda Rao Narasimhan , Mohammad Amin Nabian , Oliver Hennigh , Sanjay Choudhry , Kaustubh Mahesh Tangsali
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.
-
4.发明公开公开(公告)号：US20230309272A1
公开(公告)日：2023-09-28
申请号：US17704678
申请日：2022-03-25
Applicant: Nvidia Corporation
Inventor： Susheela Nanjunda Rao Narasimhan , Mohammad Amin Nabian , Oliver Hennigh , Sanjay Choudhry , Kaustubh Mahesh Tangsali
IPC: H05K7/20
CPC classification number: H05K7/20827 , H05K7/20836 , H05K7/20409
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.
-
-
-
Search Results
4
records
(took 0.011 seconds)
