公开(公告)号：US20160240491A1

公开(公告)日：2016-08-18

申请号：US14620575

申请日：2015-02-12

Applicant: NXP B.V.

Inventor： Christian Weinschenk ,  Amar Ashok Mavinkurve

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/02 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/564 ,  H01L21/02282 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit.

Abstract translation: RF封装包括：RF电路; 耦合到所述RF电路的非气体介电材料，并且具有基于所述RF电路中的磁场的厚度; 以及密封剂材料，其耦合以在RF电路的至少一侧上覆盖RF电路和非气体介电材料。 一种封装制造方法，包括：识别RF电路; 在RF电路上分配非气态电介质材料，其中所述非气态电介质材料的至少一部分具有基于所述RF电路中的磁场的厚度; 并且在RF电路的至少一侧上用密封剂材料覆盖RF电路和非气体介电材料。

公开(公告)号：US20140131899A1

公开(公告)日：2014-05-15

申请号：US14077138

申请日：2013-11-11

Applicant: NXP B.V.

Inventor： Christian Weinschenk

IPC: H01L23/49 ,  H01L21/56

CPC classification number: H01L23/49 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L24/42 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The invention refers to method for packaging an integrated circuit (IC) comprising steps of: attaching at least one die on a substrate; attaching bond-wires from the die(s) to package terminal pads; mold or dispense a thermo-degradable material on the substrate, die(s) and bond-wires; mold an encapsulant material; decompose the thermo-degradable materials by temperature treatment.

Abstract translation: 本发明涉及一种用于封装集成电路（IC）的方法，包括以下步骤：将至少一个管芯附接到衬底上; 将焊丝从模具附接到封装端子焊盘; 在基材，模头和接合线上模制或分配热可降解材料; 模塑密封材料; 通过温度处理分解热降解材料。

公开(公告)号：US09461005B2

公开(公告)日：2016-10-04

申请号：US14620575

申请日：2015-02-12

Applicant: NXP B.V.

Inventor： Christian Weinschenk ,  Amar Ashok Mavinkurve

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/02 ,  H01L21/56

CPC classification number: H01L23/564 ,  H01L21/02282 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit.

Abstract translation: RF封装包括：RF电路; 耦合到所述RF电路的非气体介电材料，并且具有基于所述RF电路中的磁场的厚度; 以及密封剂材料，其耦合以在RF电路的至少一侧上覆盖RF电路和非气体介电材料。 一种封装制造方法，包括：识别RF电路; 在RF电路上分配非气态电介质材料，其中至少一部分非气体电介质材料具有基于RF电路中的磁场的厚度; 并且在RF电路的至少一侧上用密封剂材料覆盖RF电路和非气体介电材料。

公开(公告)号：US09252085B2

公开(公告)日：2016-02-02

申请号：US14077138

申请日：2013-11-11

Applicant: NXP B.V.

Inventor： Christian Weinschenk

IPC: H01L21/00 ,  H01L23/49 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L24/42 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The invention refers to method for packaging an integrated circuit (IC) comprising steps of: attaching at least one die on a substrate; attaching bond-wires from the die(s) to package terminal pads; mold or dispense a thermo-degradable material on the substrate, die(s) and bond-wires; mold an encapsulant material; decompose the thermo-degradable materials by temperature treatment.

Abstract translation: 本发明涉及一种用于封装集成电路（IC）的方法，包括以下步骤：将至少一个管芯附接到衬底上; 将焊丝从模具附接到封装端子焊盘; 在基材，模头和接合线上模制或分配热可降解材料; 模塑密封材料; 通过温度处理分解热降解材料。