公开(公告)号：US20140342527A1

公开(公告)日：2014-11-20

申请号：US14449522

申请日：2014-08-01

Applicant: NXP B.V.

Inventor： Peter Gerard STEENEKEN ,  Roel DAAMEN ,  Gerard KOOPS ,  Jan SONSKY ,  Evelyne GRIDELET ,  Coenraad Cornelis TAK

IPC: H01L21/762

CPC classification number: H01L21/76232 ,  H01L21/76224 ,  H01L21/823878

Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.