公开(公告)号：US20180019709A1

公开(公告)日：2018-01-18

申请号：US15633375

申请日：2017-06-26

Applicant: NXP B.V.

Inventor： Henricus Hubertus van den Berg ,  Michiel Alexander Hallie ,  Joannes Theodorus van der Heiden

IPC: H03F1/02 ,  H03F3/50 ,  H02M1/08

CPC classification number: H03F1/0255 ,  G01R31/3004 ,  G01R31/31712 ,  G01R31/31924 ,  H02M1/082 ,  H03F3/50 ,  H03K19/018521

Abstract: An integrated circuit and method are provided. The integrated circuit comprises: a digital core configured to output a first voltage signal: and a first input/output cell: wherein the first input/output cell is configured to convert the first voltage signal to a first current signal and provide the first current signal to circuitry external to the integrated circuit.

公开(公告)号：US10008985B2

公开(公告)日：2018-06-26

申请号：US15633375

申请日：2017-06-26

Applicant: NXP B.V.

Inventor： Henricus Hubertus van den Berg ,  Michiel Alexander Hallie ,  Joannes Theodorus van der Heiden

IPC: H03F1/02 ,  H03K19/0185 ,  H03F3/50 ,  H02M1/08

CPC classification number: H03F1/0255 ,  G01R31/3004 ,  G01R31/31712 ,  G01R31/31924 ,  H02M1/082 ,  H03F3/50 ,  H03K19/018521

Abstract: An integrated circuit and method are provided. The integrated circuit comprises: a digital core configured to output a first voltage signal; and a first input/output cell; wherein the first input/output cell is configured to convert the first voltage signal to a first current signal and provide the first current signal to circuitry external to the integrated circuit.

公开(公告)号：US20180172761A1

公开(公告)日：2018-06-21

申请号：US15841520

申请日：2017-12-14

Applicant: NXP B.V.

Inventor： Johannes Petrus Wilhelmus van Beers ,  Henricus Hubertus van den Berg ,  Richard Morren ,  Joannes Theodorus van der Heiden ,  Evert-Jan Pol

IPC: G01R31/28

CPC classification number: G01R31/2884 ,  G01R31/318505 ,  G01R31/318533 ,  G01R31/3187 ,  G01R31/31915 ,  G06F11/27

Abstract: An integrated circuit comprising: a plurality of on-chip-instrument-modules; a test-controller-module configured to communicate data with the plurality of on-chip-instrument-modules; a functional-module configured to communicate data with the plurality of on-chip-instrument-modules; and an on-chip-instrument-controller. The on-chip-instrument controller is configured to: for each of the plurality of on-chip-instrument-modules, store an access-indicator; and based on a value of the access-indicator for each on-chip-instrument-module, enable the on-chip-instrument-module to communicate with either: the test-controller-module; or the functional-module.