公开(公告)号：US20190252256A1

公开(公告)日：2019-08-15

申请号：US15896090

申请日：2018-02-14

Applicant: NXP B.V.

Inventor： Pimpa Boonyatee ,  Ekapong Tangpattanasaeree ,  Pitak Seantumpol

IPC: H01L21/82 ,  H01L23/498 ,  H01L23/495

CPC classification number: H01L21/82 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49838 ,  H01L23/49866

Abstract: A method of singulating no-lead semiconductor devices assembled on a lead frame array, includes performing first and second laser scribing operations first and second sides of saw streets of the lead frame array, and then cutting between the first and second scribe lines, formed by the scribing operations, with a saw. The finished devices include a notch, formed by the scribing operations, at exposed portions of the device leads. Scribing the saw streets before cutting prevents smearing of the leads and the formation of burrs on the leads.

公开(公告)号：US20190164784A1

公开(公告)日：2019-05-30

申请号：US15825079

申请日：2017-11-28

Applicant: NXP B.V.

Inventor： Siriluck Wongratanaporngoorn ,  Yao Jung Chang ,  Ekapong Tangpattanasaeree ,  Paradee Jitrungruang ,  Pitak Seantumpol

IPC: H01L21/56 ,  H01L21/683 ,  H01L21/768

Abstract: A method for wafer dicing and removing separated integrated circuit (IC) dies from a carrier substrate includes mounting a wafer on a substrate using an adhesive layer, laser scribing the adhesive layer to create defect regions in the adhesive layer, and performing a breaking step to separate the laser-scribed adhesive layer into separated adhesive portions corresponding to the IC dies. For a stealth-dicing (SD) technique, defect regions also are created in the wafer using a laser and the breaking step is an expansion step that simultaneously separates the dies and corresponding portions of adhesive. For a dice-before-grind (DBG) technique, the dies are separated by backside grinding before the breaking step. Efficient adhesive-layer separation is achieved with reduced backside chipping associated with conventional blade dicing.

公开(公告)号：US10607861B2

公开(公告)日：2020-03-31

申请号：US15825079

申请日：2017-11-28

Applicant: NXP B.V.

Inventor： Siriluck Wongratanaporngoorn ,  Yao Jung Chang ,  Ekapong Tangpattanasaeree ,  Paradee Jitrungruang ,  Pitak Seantumpol

IPC: H01L21/56 ,  H01L21/768 ,  H01L21/683 ,  H01L21/67 ,  H01L21/78 ,  B23K26/00

Abstract: A method for wafer dicing and removing separated integrated circuit (IC) dies from a carrier substrate includes mounting a wafer on a substrate using an adhesive layer, laser scribing the adhesive layer to create defect regions in the adhesive layer, and performing a breaking step to separate the laser-scribed adhesive layer into separated adhesive portions corresponding to the IC dies. For a stealth-dicing (SD) technique, defect regions also are created in the wafer using a laser and the breaking step is an expansion step that simultaneously separates the dies and corresponding portions of adhesive. For a dice-before-grind (DBG) technique, the dies are separated by backside grinding before the breaking step. Efficient adhesive-layer separation is achieved with reduced backside chipping associated with conventional blade dicing.

公开(公告)号：US09812339B1

公开(公告)日：2017-11-07

申请号：US15495915

申请日：2017-04-24

Applicant: NXP B.V.

Inventor： Pimpa Boonyatee ,  Pitak Seantumpol ,  Paradee Jitrungruang

IPC: H01L21/56 ,  H01L23/28 ,  H01L21/78 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49513 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/13024 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/182

Abstract: A method of packaging a semiconductor die includes the steps of mounting the semiconductor die on a carrier, electrically connecting electrical contact pads of the semiconductor die to external electrical contacts, and encapsulating the die with a mold compound to form a packaged die. The packaged die is then thinned by using a dicing saw blade to trim the mold compound off of the top, non-active side of the package using a series of vertical cuts. This thinning step can be performed at the same time as a normal dicing step so no additional equipment or process steps are needed. Further, packages of varying thicknesses can be assembled simultaneously.