公开(公告)号：US10107779B2

公开(公告)日：2018-10-23

申请号：US15907126

申请日：2018-02-27

Applicant: NXP USA, Inc.

Inventor： Raymond M. Roop ,  Jose Fernandez Villasenor ,  Stephen R. Hooper ,  Patrice M. Parris

IPC: G01N27/414 ,  H05K3/10

Abstract: Embodiments of sensing devices include one or more integrated circuit (IC) die, a housing, and a fluid barrier material. Each IC die includes an electrode-bearing surface and a contact surface. One of the die includes an SFET with a sensing electrode proximate to the electrode-bearing surface. The same or a different die includes a reference electrode proximate to the electrode-bearing surface. The die(s) also include IC contacts at the contact surface(s), and conductive structures coupled between the SFET, the reference electrode, and the IC contacts. The housing includes a mounting surface, and housing contacts formed at the mounting surface. The IC contacts are coupled to the housing contacts. The fluid barrier material is positioned between the mounting surface and the IC die. The fluid barrier material provides a fluid barrier between the IC and housing contacts and a space that encompasses the sensing electrode and the reference electrode.

公开(公告)号：US20170174509A1

公开(公告)日：2017-06-22

申请号：US15448801

申请日：2017-03-03

Applicant: NXP USA, INC.

Inventor： Chad S. Dawson ,  Stephen R. Hooper ,  Fengyuan Li ,  Arvind S. Salian

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00865 ,  B81C2203/0109 ,  H01L2224/48145 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package.

公开(公告)号：US09790089B2

公开(公告)日：2017-10-17

申请号：US15448801

申请日：2017-03-03

Applicant: NXP USA, INC.

Inventor： Chad S. Dawson ,  Stephen R. Hooper ,  Fengyuan Li ,  Arvind S. Salian

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00865 ,  B81C2203/0109 ,  H01L2224/48145 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package.