公开(公告)号：US20180231579A1

公开(公告)日：2018-08-16

申请号：US15432133

申请日：2017-02-14

申请人： NXP USA, INC.

发明人： Aaron A. Geisberger ,  Fengyuan Li

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  G01P2015/0808 ,  G01P2015/0814 ,  G01P2015/0831 ,  G01P2015/0871

摘要： A microelectromechanical systems (MEMS) device, such as a single axis accelerometer, includes a movable mass suspended from a substrate. The movable mass has a first portion and a second portion. A first spring system interconnects the first portion of the movable mass with the second portion of the movable mass. A second spring system interconnects the first portion with an anchor system. The first spring system enables movement of the second portion of the movable mass in response to a shock event force imposed on the movable mass in a first direction that is orthogonal to a sense direction, wherein the first spring system inhibits movement of the first portion of the movable mass in the first direction in response to the shock event force. However, the first and second movable masses move together in response to an acceleration force in the sense direction.

公开(公告)号：US09818656B1

公开(公告)日：2017-11-14

申请号：US15602250

申请日：2017-05-23

申请人： NXP USA, Inc.

发明人： Mark Edward Schlarmann ,  Dwight Lee Daniels ,  Stephen Ryan Hooper ,  Chad Dawson ,  Fengyuan Li

IPC分类号： H01L21/673 ,  H01L21/66 ,  H01L23/00 ,  H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L21/78 ,  G01R31/28

CPC分类号： H01L22/14 ,  H01L21/561 ,  H01L21/67309 ,  H01L21/78 ,  H01L22/20 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

摘要： A method of testing includes attaching a first and second die to first and second die sites of a lead frame and forming a plurality of wire bonds coupling a plurality of pins of the first die site to the first die and a plurality of pins of the second die site to the second die. The first and second die are encapsulated. An isolation cut is performed to isolate the plurality of pins of the first die site from the plurality of pins of the second die site, while maintaining electrical connection between the first tie bar of the first die site and the first tie bar of the second die site. The first and second die are tested while providing a first power supply source to the first and second die via the first tie bars. After testing, the dies sites are fully singulated to result in packaged IC device.

公开(公告)号：US11499987B2

公开(公告)日：2022-11-15

申请号：US16904182

申请日：2020-06-17

申请人： NXP USA, Inc.

发明人： Andrew C McNeil ,  Fengyuan Li

IPC分类号： G01P15/125 ,  B81B3/00 ,  G01P15/08

摘要： A sensor includes a movable element adapted for rotational motion about a rotational axis due to acceleration along an axis perpendicular to a surface of a substrate. The movable element includes first and second ends, a first section having a first length between the rotational axis and the first end, and a second section having a second length between the rotational axis and the second end that is less than the first length. A motion stop extends from the second end of the second section. The first end of the first section includes a geometric stop region for contacting the surface of the substrate at a first distance away from the rotational axis. The motion stop for contacting the surface of the substrate at a second distance away from the rotational axis. The first and second distances facilitate symmetric stop performance between the geometric stop region and the motion stop.

公开(公告)号：US09790089B2

公开(公告)日：2017-10-17

申请号：US15448801

申请日：2017-03-03

申请人： NXP USA, INC.

发明人： Chad S. Dawson ,  Stephen R. Hooper ,  Fengyuan Li ,  Arvind S. Salian

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00865 ,  B81C2203/0109 ,  H01L2224/48145 ,  H01L2924/181 ,  H01L2924/00012

摘要： A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package.

公开(公告)号：US20210396781A1

公开(公告)日：2021-12-23

申请号：US16904182

申请日：2020-06-17

申请人： NXP USA, Inc.

发明人： Andrew C. McNeil ,  Fengyuan Li

IPC分类号： G01P15/125 ,  B81B3/00

摘要： A sensor includes a movable element adapted for rotational motion about a rotational axis due to acceleration along an axis perpendicular to a surface of a substrate. The movable element includes first and second ends, a first section having a first length between the rotational axis and the first end, and a second section having a second length between the rotational axis and the second end that is less than the first length. A motion stop extends from the second end of the second section. The first end of the first section includes a geometric stop region for contacting the surface of the substrate at a first distance away from the rotational axis. The motion stop for contacting the surface of the substrate at a second distance away from the rotational axis. The first and second distances facilitate symmetric stop performance between the geometric stop region and the motion stop.

公开(公告)号：US10247753B2

公开(公告)日：2019-04-02

申请号：US15432133

申请日：2017-02-14

申请人： NXP USA, INC.

发明人： Aaron A. Geisberger ,  Fengyuan Li

IPC分类号： G01P15/125 ,  G01P15/08

摘要： A microelectromechanical systems (MEMS) device, such as a single axis accelerometer, includes a movable mass suspended from a substrate. The movable mass has a first portion and a second portion. A first spring system interconnects the first portion of the movable mass with the second portion of the movable mass. A second spring system interconnects the first portion with an anchor system. The first spring system enables movement of the second portion of the movable mass in response to a shock event force imposed on the movable mass in a first direction that is orthogonal to a sense direction, wherein the first spring system inhibits movement of the first portion of the movable mass in the first direction in response to the shock event force. However, the first and second movable masses move together in response to an acceleration force in the sense direction.

公开(公告)号：US20170174509A1

公开(公告)日：2017-06-22

申请号：US15448801

申请日：2017-03-03

申请人： NXP USA, INC.

发明人： Chad S. Dawson ,  Stephen R. Hooper ,  Fengyuan Li ,  Arvind S. Salian

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00865 ,  B81C2203/0109 ,  H01L2224/48145 ,  H01L2924/181 ,  H01L2924/00012

摘要： A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package.