公开(公告)号：US10330475B2

公开(公告)日：2019-06-25

申请号：US15637955

申请日：2017-06-29

Applicant: NXP USA, INC.

Inventor： Thierry Cassagnes ,  Gerhard Trauth ,  Margaret Leslie Kniffin ,  Aaron A. Geisberger

IPC: G01C19/5726 ,  B81C1/00 ,  G01C19/5755 ,  G01C19/5769 ,  G01C19/5733

Abstract: An integrated device includes a MEMS device, such as a gyroscope, having a movable mass spaced apart from a substrate, the movable mass being configured to oscillate in a drive direction relative to the substrate. The integrated device further comprises an integrated circuit (IC) die having a surface coupled with the MEMS device such that the movable mass is interposed between the substrate and the surface of the IC die. An electrode structure is formed on the surface of the IC die, the electrode structure including a plurality of electrode segments vertically spaced apart from the movable mass. Openings extend through the movable mass and the electrode segments overlie the openings. Suitably selected electrode segments can be activated to electrostatically attract the movable mass toward sense electrodes vertically spaced apart from the MEMS to reduce quadrature motion of the movable mass.

公开(公告)号：US20180017387A1

公开(公告)日：2018-01-18

申请号：US15637955

申请日：2017-06-29

Applicant: NXP USA, INC.

Inventor： Thierry Cassagnes ,  Gerhard Trauth ,  Margaret Leslie Kniffin ,  Aaron A. Geisberger

IPC: G01C19/5726 ,  G01C19/5755 ,  B81C1/00 ,  G01C19/5769

CPC classification number: G01C19/5726 ,  B81B2201/0285 ,  B81C1/00198 ,  B81C1/00246 ,  G01C19/5733 ,  G01C19/5755 ,  G01C19/5769

Abstract: An integrated device includes a MEMS device, such as a gyroscope, having a movable mass spaced apart from a substrate, the movable mass being configured to oscillate in a drive direction relative to the substrate. The integrated device further comprises an integrated circuit (IC) die having a surface coupled with the MEMS device such that the movable mass is interposed between the substrate and the surface of the IC die. An electrode structure is formed on the surface of the IC die, the electrode structure including a plurality of electrode segments vertically spaced apart from the movable mass. Openings extend through the movable mass and the electrode segments overlie the openings. Suitably selected electrode segments can be activated to electrostatically attract the movable mass toward sense electrodes vertically spaced apart from the MEMS to reduce quadrature motion of the movable mass.