摘要:
A micro-electromechanical device includes a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.
摘要:
A self-tuning impedance-matching microelectromechanical (MEMS) circuit, methods for making and using the same, and circuits including the same are disclosed. The MEMS circuit includes a tunable reactance element connected to a first mechanical spring, a separate tunable or fixed reactance element, and an AC signal source configured to provide an AC signal to the tunable reactance element(s). The reactance elements comprise a capacitor and an inductor. The AC signal source creates an electromagnetically energy favorable state for the tunable reactance element(s) at resonance with the AC signal. The method of making generally includes forming a first MEMS structure and a second mechanical or MEMS structure in/on a mechanical layer above an insulating substrate, and coating the first and second structures with a conductor to form a first tunable reactance element and a second tunable or fixed reactance element, as in the MEMS circuit.
摘要:
A system and/or method for utilizing mechanical motion limiters to control proof mass amplitude in MEMS devices (e.g., MEMS devices having resonant MEMS structures, for example various implementations of gyroscopes, magnetometers, accelerometers, etc.). As a non-limiting example, amplitude control for a MEMS gyroscope proof mass may be accomplished during normal (e.g., steady state) gyroscope operation utilizing impact stops (e.g., bump stops) of various designs. As another non-limiting example, amplitude control for a MEMS gyroscope proof mass may be accomplished utilizing non-impact limiters (e.g., springs) of various designs, for example springs exhibiting non-linear stiffness characteristics through at least a portion of their normal range of operation.
摘要:
One embodiment of the invention includes a vibrating-mass gyroscope system. The system includes a sensor system comprising a vibrating-mass and a plurality of electrodes coupled to the vibrating-mass that are configured to facilitate in-plane motion of the vibrating-mass. The system also includes a gyroscope controller configured to generate a drive signal that is provided to a first set of the plurality of electrodes to provide an in-plane periodic oscillatory motion of the vibrating-mass along a drive axis, to generate a force-rebalance signal that is provided to a second set of the plurality of electrodes to calculate a rotation of the vibrating-mass gyroscope system about an input axis, and to generate a quadrature signal that is provided to a third set of the plurality of electrodes to substantially mitigate quadrature effects associated with the vibrating-mass.
摘要:
Methods of forming micro-electromechanical device include a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.
摘要:
Micro-electro-mechanical-systems (MEMS) sensors and methods for detecting rates of rotation thereof. The MEMS sensor has at least one driving mass that oscillates along the x-axis, and at least one sensing mass coupled to the driving mass so that the sensing and driving masses move relative to each other in the x direction and are coupled for rotation together about the y and/or z axes. At least one anchor spring couples the driving or sensing mass to an anchor secured to a substrate. Rotation of the MEMS sensor is sensed by sensing relative movement between the substrate and sensing mass. During its oscillation, the driving mass generates an imbalance of the driving and sensing masses with respect to the anchor, and Coriolis forces cause the sensing and driving masses to rotate together about the y or z axis when the MEMS sensor rotates about the y or z axis.
摘要:
A physical quantity sensor includes a base substrate, a movable portion that is oscillatably provided around an axis while facing the base substrate and that is divided into a first movable portion and a second movable portion, a first fixed electrode that is disposed on the base substrate facing the first movable portion, and a second fixed electrode that is disposed on the base substrate facing the second movable portion. The first fixed electrode and the second fixed electrode are configured so as to offset at least a part of a difference between a first fringe capacitance, which is between the first movable portion and the first fixed electrode, and a second fringe capacitance, which is between the second movable portion and the second fixed electrode.
摘要:
This document discusses, among other things, an inertial measurement system including a device layer including a single proof-mass 3-axis accelerometer, a cap wafer bonded to a first surface of the device layer, and a via wafer bonded to a second surface of the device layer, wherein the cap wafer and the via wafer are configured to encapsulate the single proof-mass 3-axis accelerometer. The single proof-mass 3-axis accelerometer can be suspended about a single, central anchor, and can include separate x, y, and z-axis flexure bearings, wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor and the z-axis flexure is not symmetrical about the single, central anchor.
摘要:
This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.
摘要:
A rotation detection sensor is provided. The rotation detection sensor includes a fixed member spaced apart from a mass body, a first flexible member connecting the mass body and the fixed member to each other in a first direction, a second flexible member connecting the mass body and the fixed member to each other in a second direction perpendicular to the first direction, and membranes connecting the mass body and the fixed member to each other, the second flexible member being disposed between the membranes.