MEMS DEVICE WITH ISOLATION SUB-FRAME STRUCTURE

    公开(公告)号:US20170225949A1

    公开(公告)日:2017-08-10

    申请号:US15497741

    申请日:2017-04-26

    申请人: NXP USA, Inc.

    IPC分类号: B81C1/00

    摘要: An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.