公开(公告)号：US11304343B1

公开(公告)日：2022-04-12

申请号：US17127594

申请日：2020-12-18

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： H05K7/20 ,  F28F3/06 ,  H01L23/427 ,  F28F3/08

摘要： A high-efficiency electronic thermal management system and method providing a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface mounted in thermal communication with a heat source. The lower block having an inclined upper surface configured to be in thermal communication with a block directly above, having a complemental inclined surface. These blocks are elastically coupled. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block, and to a cold plate cooling source. The cold plate also has internal fins and flowing liquid for heat dispersion.

公开(公告)号：US11304338B1

公开(公告)日：2022-04-12

申请号：US17108808

申请日：2020-12-01

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： H05K7/20

摘要： A system, method, and apparatus for a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface that is configured to be engaged in thermal communication with a heat source. The lower block also having an inclined upper surface, that is configured to be in thermal communication with a block directly above, having a complemental inclined surface, wherein the blocks are elastically coupled with elastic components. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block and to a cooling source.

公开(公告)号：US20220418166A1

公开(公告)日：2022-12-29

申请号：US17360003

申请日：2021-06-28

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： H05K7/20

摘要： A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.

公开(公告)号：US20220418160A1

公开(公告)日：2022-12-29

申请号：US17487013

申请日：2021-09-28

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： H05K7/20

摘要： A system having a shell with a shell interior for housing a heat exchanger that is configured to be operable for heat transfer between a first fluid and a second fluid; a refrigerant inlet, wherein the first fluid passes from the refrigerant inlet to the shell interior for heat transfer; a refrigerant inlet manifold, wherein the refrigerant inlet manifold is configured to collect the first fluid from the refrigerant inlet for the heat transfer; a refrigerant outlet, the refrigerant outlet is configured to be operable for supplying the first fluid for electronic device cooling; a coolant inlet, wherein the second fluid flows from the coolant inlet and into the shell interior for the heat transfer; and a coolant outlet for discharging the second fluid out of the shell interior.

公开(公告)号：US11903171B2

公开(公告)日：2024-02-13

申请号：US17880866

申请日：2022-08-04

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC分类号： H05K7/20809 ,  H05K7/20327 ,  H05K7/20345

摘要： A system including a heat exchanger section for re-cooling a heated liquid coolant, a spray cooling section for cooling an electronic equipment; mean for separating said heat exchanger or pump section from said spray cooling section; means for transferring heat generated by the electronic equipment to at least liquid coolant; means for spraying the liquid coolant along the heat transferring means to transfer heat from the electronic equipment to the liquid coolant; wherein the heat transferring means is in an essentially vertical position so that the liquid coolant generally flows downward and is drained by gravity; means for collecting the liquid coolant; means for suctioning the collected liquid coolant; means for pumping the dielectric liquid coolant from the sprayed liquid coolant collecting means and through the liquid coolant spraying means; and means for housing the system.

公开(公告)号：US20220412672A1

公开(公告)日：2022-12-29

申请号：US17501983

申请日：2021-10-14

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： F28F3/12 ,  F28F3/04

摘要： A heat sink device including: a cover module having a liquid inlet; a central flow channel for distributing coolant fluid introduced into the liquid inlet of the cover module; a plurality of inner fins; a plurality of inner radial flow channels; wherein coolant fluid from the central flow channel flows into the inner radial flow channels; a ring segment disposed around an outer perimeter of the plurality of inner fins, wherein the ring segment is configured to at least one of, mix and distribute coolant fluid received from the inner radial flow channels; a plurality of outer fins; a plurality of outer radial flow channels; wherein coolant fluid from the ring segment flows into the outer radial flow channels; and an outer flow channel, wherein coolant fluid flowing out of the radial flow channels outlet drains into the outer flow channel.

公开(公告)号：US20240164065A1

公开(公告)日：2024-05-16

申请号：US18419330

申请日：2024-01-22

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  H05K7/20309 ,  H05K7/20318

摘要： A system for reusing heat from a data center that can provide heating and cooling for multiple purposes involving a phase change material and involving a heat pump system; in which a piping system is configured to provide a stable temperature output; and in which an evaporation portion of the system and a condensation portion of the system can both be used for heating and cooling.

公开(公告)号：US20240011666A1

公开(公告)日：2024-01-11

申请号：US18338217

申请日：2023-06-20

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： F24H1/20 ,  G06F1/20

CPC分类号： F24H1/208 ,  G06F1/20 ,  F24H2250/00

摘要： A system is provided for cooling the heat generated by a miner, the system includes a liquid cooling chassis comprising a miner and a dielectric fluid enclosure and a water tank kit for storing water, the water tank kit includes a coil with said dielectric fluid, wherein the heat generated from said miner is transferred to the water stored in said water tank kit by pumping the heated dielectric fluid from the liquid cooling chassis into the coil in the water tank kit to produce a heat source thereof.

公开(公告)号：US20230045752A1

公开(公告)日：2023-02-09

申请号：US17880866

申请日：2022-08-04

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： H05K7/20

摘要： A system and method for cooling electronic equipment having a power supply unit separate from the equipment, sprayers that spray a dielectric liquid coolant on the top of the equipment lengthwise along one or more fins of one or more heat sinks on the equipment, a reservoir, connectors, and pumps for pumping the liquid coolant from the reservoir and through the sprayer, and an external housing.

公开(公告)号：US20220418155A1

公开(公告)日：2022-12-29

申请号：US17487000

申请日：2021-09-28

申请人： Nan Chen ,  He Zhao ,  Yunshui Chen

发明人： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC分类号： H05K7/20

摘要： A device including a microchannel heat sink having a first layer circle A and circle B fins and a second layer circle A and circle B fins, wherein circle A fins includes a plurality of outer ring fins and circle B fins includes a plurality of inner ring fins; a cover assembly, in which the cover assembly includes adaptors, a liquid channel, a vapor channel, and a TRV chamber; a thermal regulation valve (TRV), wherein the thermal regulation valve (TRV) is configured to enable dynamic responses for temperature control in the microchannel heat sink; and a temperature sensing mechanism, in which the temperature sensing mechanism is configured to be operable for detecting temperature variations and converting the temperature variations to pressure variations.