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    Designing and fabrication of a semiconductor device
    1.
    发明申请
    Designing and fabrication of a semiconductor device 有权
    设计和制造半导体器件

    公开(公告)号：US20060113628A1

    公开(公告)日：2006-06-01

    申请号：US11333212

    申请日：2006-01-18

    申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    IPC分类号： H01L29/00

    CPC分类号： G06F17/5068 ,  H01L21/31053

    摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

    摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

    Designing a semiconductor device layout using polishing regions
    2.
    发明授权
    Designing a semiconductor device layout using polishing regions 有权
    使用抛光区域设计半导体器件布局

    公开(公告)号：US07017133B2

    公开(公告)日：2006-03-21

    申请号：US10849368

    申请日：2004-05-20

    申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5068 ,  H01L21/31053

    摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

    摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

    Designing and fabrication of a semiconductor device
    3.
    发明授权
    Designing and fabrication of a semiconductor device 有权
    设计和制造半导体器件

    公开(公告)号：US07424688B2

    公开(公告)日：2008-09-09

    申请号：US11333212

    申请日：2006-01-18

    申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5068 ,  H01L21/31053

    摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

    摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

    Designing and fabrication of a semiconductor device
    4.
    发明申请
    Designing and fabrication of a semiconductor device 有权
    设计和制造半导体器件

    公开(公告)号：US20050160381A1

    公开(公告)日：2005-07-21

    申请号：US10849368

    申请日：2004-05-20

    申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

    IPC分类号： H01L21/76 ,  G06F17/50 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3205 ,  H01L21/82 ,  H01L21/822 ,  H01L27/04

    CPC分类号： G06F17/5068 ,  H01L21/31053

    摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

    摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

    OPTICAL UNIT WITH SHAKE CORRECTING FUNCTION
    8.
    发明申请
    OPTICAL UNIT WITH SHAKE CORRECTING FUNCTION 有权
    具有振动校正功能的光学单元

    公开(公告)号：US20130128360A1

    公开(公告)日：2013-05-23

    申请号：US13813229

    申请日：2011-07-22

    申请人： Shinji Minamisawa ,  Shinroku Asakawa ,  Tatsuki Wade ,  Toshiyuki Karasawa ,  Hisahiro Ishihara

    发明人： Shinji Minamisawa ,  Shinroku Asakawa ,  Tatsuki Wade ,  Toshiyuki Karasawa ,  Hisahiro Ishihara

    IPC分类号： G02B27/64

    CPC分类号： G02B27/64 ,  G02B27/646 ,  G03B5/00 ,  G03B2205/0023 ,  G03B2205/0069 ,  H04N5/2252

    摘要： An optical unit may include a fixed body, a movable module w rich holds an optical element, a swing support point which swingably supports the movable module, and a shake correction drive mechanism structured to swing the movable module with the swing support point as a swing center. The swing support point may be structured of an abutte d portion of two members in an optical axis direction between a bottom part of the movable module and a bottom part of the fixed body. At least one of the two members may be made of elastic material.

    摘要翻译： 光学单元可以包括固定体，可移动模块富有保持光学元件，可摆动地支撑可移动模块的摆动支撑点和摇摆校正驱动机构，其构造成使可动模块与摆动支撑点摆动摆动 中央。 摆动支撑点可以由可移动模块的底部和固定体的底部之间的光轴方向上的两个构件的邻接部分构成。 两个构件中的至少一个可以由弹性材料制成。

    Optical Unit with Shake Correcting Function
    9.
    发明申请
    Optical Unit with Shake Correcting Function 有权
    具有振动校正功能的光学单元

    公开(公告)号：US20130100304A1

    公开(公告)日：2013-04-25

    申请号：US13702426

    申请日：2011-05-24

    申请人： Tatsuki Wade ,  Shinroku Asakawa ,  Shinji Minamisawa ,  Toshiyuki Karasawa ,  Katsushige Yanagisawa ,  Yoshihiro Hamada ,  Hayato Naito ,  Ryoji Komatsu ,  Hisahiro Ishihara

    发明人： Tatsuki Wade ,  Shinroku Asakawa ,  Shinji Minamisawa ,  Toshiyuki Karasawa ,  Katsushige Yanagisawa ,  Yoshihiro Hamada ,  Hayato Naito ,  Ryoji Komatsu ,  Hisahiro Ishihara

    IPC分类号： H04N5/232

    CPC分类号： H04N5/23264 ,  G02B27/646 ,  G03B5/00 ,  G03B2205/0023 ,  G03B2205/0069 ,  H04N5/23258 ,  H04N5/23287

    摘要： An optical unit may include a fixed body; a movable module which holds an optical element; a swing support point which swingably supports the movable module; a shake correction drive mechanism which swings the movable module with the swing support point as a swing center around two axial lines intersecting an optical axis direction of the optical element between an outer peripheral face of the movable module and the fixed body; a first photo reflector provided between a bottom part of the movable module and the fixed body at a position superposing on one of the two axial lines and that detects displacement of the movable module; and a second photo reflector provided between the bottom part of the movable module and the fixed body at a position superposing on the other of the two axial lines and that detects displacement of the movable module.

    摘要翻译： 光学单元可以包括固定体; 保持光学元件的可移动模块; 可摆动地支撑可移动模块的摆动支撑点; 摇动校正驱动机构，其使作为摆动支承点的可动模块摆动在与所述可移动模块的外周面与所述固定体之间的与所述光学元件的光轴方向交叉的两条轴线的摆动中心; 第一光反射器，设置在所述可移动模块的底部和所述固定体之间，叠置在所述两条轴线中的一条轴线上并且检测所述可移动模块的位移的位置; 以及设置在所述可移动模块的底部与所述固定体之间的叠加在所述两条轴线中的另一条上的位置并且检测所述可移动模块的位移的第二光反射体。

    Optical unit with shake correcting function
    10.
    发明授权
    Optical unit with shake correcting function 有权
    具有抖动校正功能的光学单元

    公开(公告)号：US08279289B2

    公开(公告)日：2012-10-02

    申请号：US12579136

    申请日：2009-10-14

    申请人： Akihiro Nagata ,  Toshiyuki Karasawa ,  Yuichi Takei ,  Tadashi Takeda ,  Hisahiro Ishihara ,  Shinji Minamisawa ,  Katsushige Yanagisawa ,  Kiyoshi Miyazaki

    发明人： Akihiro Nagata ,  Toshiyuki Karasawa ,  Yuichi Takei ,  Tadashi Takeda ,  Hisahiro Ishihara ,  Shinji Minamisawa ,  Katsushige Yanagisawa ,  Kiyoshi Miyazaki

    IPC分类号： H04N5/228 ,  G02B27/64

    CPC分类号： H04N5/2254 ,  G02B27/646 ,  H04N5/2257 ,  H04N5/23248 ,  H04N5/23287

    摘要： An optical unit with shake correcting function may include a movable module having a lens, a fixed body supporting the movable module, a shake detection sensor for detecting shake of the movable module, and at least one pair of magnetic drive mechanism for shake correction which is structured on both sides of the movable module so that the movable module is swung with respect to the fixed body on the basis of detection result of the shake detection sensor to correct the shake of the movable module. The magnetic drive mechanism for shake correction is disposed so that a shake correction magnet is held by the fixed body and a shake correction coil is held by the movable module. Further, a shake correction coil may be disposed in a first region, where magnetic lines of force generated by a shake correction magnet are directed in directions generally going away from a supporting point part and/or a second region where magnetic lines of force generated by the shake correction magnet are directed in directions generally going toward the supporting point part.

    摘要翻译： 具有抖动校正功能的光学单元可以包括具有透镜的可移动模块，支撑可移动模块的固定体，用于检测可动模块的抖动的抖动检测传感器，以及用于抖动校正的至少一对磁驱动机构， 结构在可动模块的两侧，使得可移动模块基于抖动检测传感器的检测结果相对于固定体摆动，以校正可移动模块的抖动。 用于抖动校正的磁驱动机构被布置成使得振动校正磁体被固定体保持，并且抖动校正线圈由可移动模块保持。 此外，抖动校正线圈可以设置在第一区域中，其中由振动校正磁体产生的磁力线通常沿着远离支撑点部分的方向指向，和/或第二区域，其中由 振动校正磁体沿着通常朝向支撑点部分的方向指向。