公开(公告)号：US20060113628A1

公开(公告)日：2006-06-01

申请号：US11333212

申请日：2006-01-18

申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

IPC分类号： H01L29/00

CPC分类号： G06F17/5068 ,  H01L21/31053

摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

公开(公告)号：US07017133B2

公开(公告)日：2006-03-21

申请号：US10849368

申请日：2004-05-20

申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

IPC分类号： G06F17/50

CPC分类号： G06F17/5068 ,  H01L21/31053

摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

公开(公告)号：US07424688B2

公开(公告)日：2008-09-09

申请号：US11333212

申请日：2006-01-18

申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

IPC分类号： G06F17/50

CPC分类号： G06F17/5068 ,  H01L21/31053

摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

公开(公告)号：US20050160381A1

公开(公告)日：2005-07-21

申请号：US10849368

申请日：2004-05-20

申请人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

发明人： Naoki Idani ,  Toshiyuki Karasawa ,  Ryota Nanjo

IPC分类号： H01L21/76 ,  G06F17/50 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3205 ,  H01L21/82 ,  H01L21/822 ,  H01L27/04

CPC分类号： G06F17/5068 ,  H01L21/31053

摘要： Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 μm or less are excluded from the optimization.

摘要翻译： 根据以下步骤进行在其制造工艺中进行化学机械抛光工艺的电子器件的设计方法：将衬底表面分成第一子区; 优化所述第一子区域中的硬抛光区域的覆盖率落在对应于所述第一子区域的第一预定范围内; 将基板表面分成与第一子区域不同的第二子区域; 并且优化所述第二子区域中的所述硬抛光区域的覆盖率落入对应于所述第二子区域的第二预定范围中，其中具有5μm或更小边缘的边缘的图案被从所述优化中排除 。

公开(公告)号：US20080064308A1

公开(公告)日：2008-03-13

申请号：US11653953

申请日：2007-01-17

申请人： Naoki Idani

发明人： Naoki Idani

IPC分类号： B24B29/00

CPC分类号： B24B37/32

摘要： A polishing apparatus that polishes a substrate to be processed includes a rotary polishing table carrying a polishing pad on a surface thereof, and a polishing head that urges the substrate to be processed against the polishing pad while rotating the substrate to be processed, wherein the polishing head holds the substrate to be processed by a retainer ring, the retainer ring includes: a resin ring formed of a resin and contacted with the polishing pad; and an upper part ring that holds the resin ring, at least first and second patterns of convex shape or concave shape are formed on a junction surface of the upper part ring where the upper part ring is contacted with the resin ring, at least third and fourth patterns of concave shape or convex shape are formed on a junction surface of the resin ring where the resin ring makes contact with the upper electrode, in a manner complementary to the patterns of the convex shape or concave shape formed on the junction surface of the upper electrode.

摘要翻译： 对被处理基板进行抛光的抛光装置包括：在其表面承载有抛光垫的旋转研磨台，以及抛光头，其在旋转待处理基板的同时将衬底加工成抛光垫，其中抛光 头部保持用保持环加工的基板，保持环包括：由树脂形成并与抛光垫接触的树脂环; 以及保持树脂环的上部环，至少在上部环与树脂环接触的上部环的接合面上形成至少第一和第二凸起形状或凹形的图案，至少第三和第三图案 在树脂环与上电极接触的树脂环的接合面上形成凹形或凸形的第四图案，以与形成在第二表面上的凸形或凹形的图案互补的方式形成 上电极。

公开(公告)号：US20070007246A1

公开(公告)日：2007-01-11

申请号：US11264240

申请日：2005-11-02

申请人： Naoki Idani

发明人： Naoki Idani

IPC分类号： C03C15/00 ,  B44C1/22 ,  H01L21/461

CPC分类号： H01L21/31053 ,  B24B37/042 ,  H01L21/02065 ,  H01L21/823871

摘要： A manufacture method for a semiconductor device, includes the steps of: in CMP for forming STI, (a) polishing the surface of a film formed on a semiconductor substrate until the surface of the film is planarized, by using first abrasive containing cerium dioxide abrasive grains and additive of interfacial active agent; (b) after the step (a), polishing the surface of the film is polished by using second abrasive having a physical polishing function; and (c) after the step (b), polishing the surface of the film by using third abrasive containing cerium dioxide abrasive grains, additive of interfacial active agent, and diluent. The manufacture method further includes the steps of: (p) forming wirings above the semiconductor substrate; (q) depositing a first insulating film by HDP CVD, the first insulating film burying the wirings; (r) depositing a second insulating film above the first insulating film by a deposition method different from HDP-CVD; and (s) planarizing the second insulating film by chemical mechanical polishing using abrasive containing cerium dioxide abrasive grains. It is possible to solve an issue of a left film after polishing newly found from a large size substrate and to suppress a distribution of thicknesses of an interlayer insulating film at a wafer level.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：在CMP中形成STI，（a）研磨形成在半导体衬底上的膜的表面，直到膜的表面平坦化为止，使用含有二氧化铈研磨剂 界面活性剂的颗粒和添加剂; （b）在步骤（a）之后，通过使用具有物理抛光功能的第二磨料抛光抛光所述膜的表面; 和（c）在步骤（b）之后，通过使用含有二氧化铈磨料颗粒，界面活性剂添加剂和稀释剂的第三磨料来研磨膜的表面。 制造方法还包括以下步骤：（p）在半导体衬底上形成布线; （q）通过HDP CVD沉积第一绝缘膜，所述第一绝缘膜掩埋所述布线; （r）通过不同于HDP-CVD的沉积方法在第一绝缘膜上方沉积第二绝缘膜; 和通过使用包含二氧化铈磨料颗粒的磨料进行化学机械抛光来平面化第二绝缘膜。 可以解决从大尺寸基板新发现的抛光后的左膜的问题，并抑制晶片级的层间绝缘膜的厚度分布。

公开(公告)号：US08614146B2

公开(公告)日：2013-12-24

申请号：US13025776

申请日：2011-02-11

申请人： Satoshi Takesako ,  Naoki Idani

发明人： Satoshi Takesako ,  Naoki Idani

IPC分类号： H01L21/768

CPC分类号： H01L21/7684 ,  H01L21/31144 ,  H01L21/3212 ,  H01L21/76808 ,  H01L21/76813 ,  H01L23/522 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device manufacture method includes: forming an insulating film above a semiconductor substrate; etching the insulating film to form a dummy groove having a first depth, a wiring groove having a second depth deeper than the first depth, and a via hole to be disposed on a bottom of the wiring groove; depositing a conductive material in the dummy groove, wiring groove and via hole and above the insulating film; and polishing and removing the conductive material above the insulating film.

摘要翻译： 半导体器件制造方法包括：在半导体衬底上形成绝缘膜; 蚀刻绝缘膜以形成具有第一深度的虚设槽，具有比第一深度更深的第二深度的布线槽和布置在布线槽的底部的通孔; 在虚设槽，布线槽和通孔中以及绝缘膜上方沉积导电材料; 并且在绝缘膜上抛光和去除导电材料。

公开(公告)号：US07908698B2

公开(公告)日：2011-03-22

申请号：US11411874

申请日：2006-04-27

申请人： Naoki Idani

发明人： Naoki Idani

IPC分类号： B08B7/00

CPC分类号： H01L21/67046 ,  B08B1/00 ,  B08B3/04

摘要： A wafer on which a CMP processing is completed is rotated. A front surface cleaning brush and a rear surface cleaning brush are made contact both surfaces of the wafer while being rotated. After the front surface cleaning brush and the rear surface cleaning brush are made to contact the wafer, both end portions of the front surface cleaning brush and the rear surface cleaning brush are deformed by means of pressurizing both ends of the front surface cleaning brush and the rear surface cleaning brush by pressure portions. That is, the both end portions of the front surface cleaning brush and the rear surface cleaning brush are compressed to enlarge diameters in the both end portions. As a consequence, the entire front surface of the wafer is made to contact the front surface cleaning brush substantially evenly, even if the wafer is warped into a shape of a mound. Therefore, a cleaning efficiency of the outer peripheral portion of the wafer improves.

公开(公告)号：US20050215180A1

公开(公告)日：2005-09-29

申请号：US10918443

申请日：2004-08-16

申请人： Naoki Idani

发明人： Naoki Idani

IPC分类号： B24B1/00 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  H01L21/304 ,  H01L21/3105

CPC分类号： H01L21/31053 ,  B24B37/042

摘要： The method for fabricating a semiconductor device comprises the step of planarizing the surface of a film-to-be-polished formed over a semiconductor substrate by polishing, with a polishing pad 104 formed of a foam with a plurality of cells 107 incorporated in a base material 105 thereof, the surface being polished with the base material alone while a polishing slurry containing abrasive grains and an additive of a surfactant is being supplied. The film-to-be-polished is polished with the polishing pad of a foam having no shells around the cells, whereby even when a polishing slurry containing the additive of a surfactant is used, the generation of scratches in the surface of the film-to-be-polished can be depressed.

摘要翻译： 用于制造半导体器件的方法包括以下步骤：通过抛光在半导体衬底上形成的待抛光膜的表面平坦化，所述抛光垫由抛光垫104形成，所述抛光垫104由泡沫形成，多个电池107并入基底 其表面仅用基材抛光，同时提供含有磨粒和表面活性剂添加剂的抛光浆料。 要抛光的被抛光的抛光垫用细胞周围没有壳的泡沫抛光垫抛光，由此即使使用含有表面活性剂添加剂的研磨浆料，也会在膜 - 被抛光可以压抑。

公开(公告)号：US08496758B2

公开(公告)日：2013-07-30

申请号：US13032817

申请日：2011-02-23

申请人： Naoki Idani

发明人： Naoki Idani

IPC分类号： B08B7/00

CPC分类号： H01L21/67046 ,  B08B1/00 ,  B08B3/04

摘要： A front surface of the wafer is contacted with a straight-shaped front surface cleaning brush, and a pressure is applied on the front surface cleaning brush from both ends to enlarge the diameters in both end portions of the front surface cleaning brush. The front surface cleaning brush rotates with a shaft being an axis. An inner surface of the front surface cleaning brush is directly in contact with a surface of the shaft. The front surface cleaning brush is composed of a single structure made of synthetic resin.

摘要翻译： 晶片的前表面与直线形的前表面清洁刷接触，并且从两端向前表面清洁刷施加压力，以增大前表面清洁刷的两端部的直径。 前表面清洁刷以轴为轴旋转。 前表面清洁刷的内表面与轴的表面直接接触。 前表面清洁刷由合成树脂制成的单一结构构成。