公开(公告)号：US20100209041A1

公开(公告)日：2010-08-19

申请号：US12623686

申请日：2009-11-23

申请人： Naoki MATSUSHIMA ,  Norio CHUJO ,  Yasunobu MATSUOKA ,  Toshiki SUGAWARA ,  Madoka MINAGAWA ,  Saori HAMAMURA ,  Satoshi KANEKO ,  Tsutomu KONO

发明人： Naoki MATSUSHIMA ,  Norio CHUJO ,  Yasunobu MATSUOKA ,  Toshiki SUGAWARA ,  Madoka MINAGAWA ,  Saori HAMAMURA ,  Satoshi KANEKO ,  Tsutomu KONO

IPC分类号： G02B6/12 ,  H01L21/00 ,  G02B6/36

CPC分类号： G02B6/4214 ,  H05K1/0274 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4644

摘要： A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.

摘要翻译： 光电复合布线模块包括电路基板，光学装置，具有驱动器的LSI和用于光学装置的放大器，以及具有电布线的薄膜布线层。 光学器件通过电线与LSI连接。 光学器件形成在电路基板上，并且光耦合到形成在电路基板中的光波导。 在光学器件上形成薄膜布线层，以确保光学器件与薄膜布线层的电气布线电连接。 LSI与薄膜布线层安装在电连接上。