公开(公告)号：US20100209041A1

公开(公告)日：2010-08-19

申请号：US12623686

申请日：2009-11-23

申请人： Naoki MATSUSHIMA ,  Norio CHUJO ,  Yasunobu MATSUOKA ,  Toshiki SUGAWARA ,  Madoka MINAGAWA ,  Saori HAMAMURA ,  Satoshi KANEKO ,  Tsutomu KONO

发明人： Naoki MATSUSHIMA ,  Norio CHUJO ,  Yasunobu MATSUOKA ,  Toshiki SUGAWARA ,  Madoka MINAGAWA ,  Saori HAMAMURA ,  Satoshi KANEKO ,  Tsutomu KONO

IPC分类号： G02B6/12 ,  H01L21/00 ,  G02B6/36

CPC分类号： G02B6/4214 ,  H05K1/0274 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4644

摘要： A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.

摘要翻译： 光电复合布线模块包括电路基板，光学装置，具有驱动器的LSI和用于光学装置的放大器，以及具有电布线的薄膜布线层。 光学器件通过电线与LSI连接。 光学器件形成在电路基板上，并且光耦合到形成在电路基板中的光波导。 在光学器件上形成薄膜布线层，以确保光学器件与薄膜布线层的电气布线电连接。 LSI与薄膜布线层安装在电连接上。

公开(公告)号：US20100002987A1

公开(公告)日：2010-01-07

申请号：US12494890

申请日：2009-06-30

申请人： Shohei HATA ,  Naoki MATSUSHIMA ,  Toshiaki TAKAI ,  Yukio SAKIGAWA ,  Satoshi ARAI

发明人： Shohei HATA ,  Naoki MATSUSHIMA ,  Toshiaki TAKAI ,  Yukio SAKIGAWA ,  Satoshi ARAI

IPC分类号： G02B6/12 ,  B32B37/00 ,  B23K1/00 ,  G02B6/10

CPC分类号： G02B6/29365 ,  G02B6/29367 ,  G02B6/4204 ,  G02B6/4246 ,  Y10T156/1052 ,  Y10T156/1089

摘要： A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

摘要翻译： 过滤元件包括具有一对平行表面的第一玻璃基板和布置在一个平行表面上的带通滤波器，一对单晶基板（Si晶片），每个单晶基板包括形成有具有倾斜的凹陷的主表面 相对于占据凹部的开口的至少一半的主表面的表面，以及具有光学元件的第二玻璃基板。 单晶衬底对的主表面被接合到玻璃衬底的一对表面上。 凹陷面向玻璃基板并围绕带通滤光片。 通过这种构造，可以通过晶片级处理以高精度和低成本大量生产过滤元件。