公开(公告)号：US20100209041A1

公开(公告)日：2010-08-19

申请号：US12623686

申请日：2009-11-23

申请人： Naoki MATSUSHIMA ,  Norio CHUJO ,  Yasunobu MATSUOKA ,  Toshiki SUGAWARA ,  Madoka MINAGAWA ,  Saori HAMAMURA ,  Satoshi KANEKO ,  Tsutomu KONO

发明人： Naoki MATSUSHIMA ,  Norio CHUJO ,  Yasunobu MATSUOKA ,  Toshiki SUGAWARA ,  Madoka MINAGAWA ,  Saori HAMAMURA ,  Satoshi KANEKO ,  Tsutomu KONO

IPC分类号： G02B6/12 ,  H01L21/00 ,  G02B6/36

CPC分类号： G02B6/4214 ,  H05K1/0274 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4644

摘要： A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.

摘要翻译： 光电复合布线模块包括电路基板，光学装置，具有驱动器的LSI和用于光学装置的放大器，以及具有电布线的薄膜布线层。 光学器件通过电线与LSI连接。 光学器件形成在电路基板上，并且光耦合到形成在电路基板中的光波导。 在光学器件上形成薄膜布线层，以确保光学器件与薄膜布线层的电气布线电连接。 LSI与薄膜布线层安装在电连接上。

公开(公告)号：US20120024959A1

公开(公告)日：2012-02-02

申请号：US13077390

申请日：2011-03-31

申请人： Madoka MINAGAWA ,  Naoya KANDA ,  Isao SAKAMA ,  Shigeru SAGAWA ,  Daisuke SHIBATA

发明人： Madoka MINAGAWA ,  Naoya KANDA ,  Isao SAKAMA ,  Shigeru SAGAWA ,  Daisuke SHIBATA

IPC分类号： G06K19/077 ,  H01L21/98

CPC分类号： H01Q1/2208 ,  G06K19/0772 ,  G06K19/07722 ,  G06K19/07754 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An RFID inlet by including: a base film; an antenna pattern formed on the base film; an insulation film layer formed on the antenna pattern and having a hole; an IC chip coupled to the antenna pattern inside the hole of the insulation film layer; and an underfill filled between the IC chip, the antenna, and the base film. The height of the IC chip top surface is at a higher level than the top surface of the insulation film layer, the underfill is formed between the IC chip and a wall surface of the hole of the insulation film layer.

摘要翻译： 一种RFID入口，包括：基膜; 形成在基膜上的天线图案; 形成在所述天线图案上并具有孔的绝缘膜层; IC芯片，耦合到绝缘膜层的孔内的天线图案; 以及填充在IC芯片，天线和基膜之间的底部填充物。 IC芯片顶面的高度比绝缘膜层的顶面高，在IC芯片与绝缘膜层的孔的壁面之间形成底部填充物。