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公开(公告)号:US20130026509A1
公开(公告)日:2013-01-31
申请号:US13640869
申请日:2011-04-14
申请人: Naoya Tohyama , Takuya Inoue , Koichi Kumagai , Takaha Kunieda
发明人: Naoya Tohyama , Takuya Inoue , Koichi Kumagai , Takaha Kunieda
CPC分类号: H01L25/167 , F21K9/23 , F21V3/00 , F21Y2115/10 , H01L33/648 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0306 , H05K1/144 , H05K3/0061 , H05K2201/062 , H05K2201/10106 , H05K2201/10378 , H01L2924/00014 , H01L2924/00
摘要: The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.
摘要翻译: 本发明包括一个或多个LED元件,通过微型凸块安装LED元件的硅衬底,并且内部形成的布线连接到微型突起,与LED元件的相对侧粘贴的隔热有机衬底, 硅基板的安装侧,并且具有布线穿过的通孔,粘贴在隔热有机基板的硅基板侧的相反侧的芯片安装基板和内部形成的布线连接到布线 隔热有机基板的通孔,以及通过微型突起与芯片安装基板的布线连接的LED控制电路芯片,并且经由隔热有机基板侧的相反侧的微凸块安装 的芯片安装基板。
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公开(公告)号:US08610141B2
公开(公告)日:2013-12-17
申请号:US13640869
申请日:2011-04-14
申请人: Naoya Tohyama , Takuya Inoue , Kouichi Kumagai , Takaha Kunieda
发明人: Naoya Tohyama , Takuya Inoue , Kouichi Kumagai , Takaha Kunieda
CPC分类号: H01L25/167 , F21K9/23 , F21V3/00 , F21Y2115/10 , H01L33/648 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0306 , H05K1/144 , H05K3/0061 , H05K2201/062 , H05K2201/10106 , H05K2201/10378 , H01L2924/00014 , H01L2924/00
摘要: The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.
摘要翻译: 本发明包括一个或多个LED元件,通过微型凸块安装LED元件的硅衬底,并且内部形成的布线连接到微型突起,与LED元件的相对侧粘贴的隔热有机衬底, 硅基板的安装侧,并且具有布线穿过的通孔,粘贴在隔热有机基板的硅基板侧的相反侧的芯片安装基板和内部形成的布线连接到布线 隔热有机基板的通孔,以及通过微型突起与芯片安装基板的布线连接的LED控制电路芯片,并且经由隔热有机基板侧的相反侧的微凸块安装 的芯片安装基板。
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