公开(公告)号：US06332268B1

公开(公告)日：2001-12-25

申请号：US09254687

申请日：1999-03-16

申请人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

发明人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

IPC分类号： H05K330

CPC分类号： H01L21/67132 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

摘要： An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).

摘要翻译： IC芯片（2）可以在被保持在带状支撑构件（5）的同时被提供到预安装工艺，而不从带状支撑构件（5）取出。

公开(公告)号：US06265673B1

公开(公告)日：2001-07-24

申请号：US08890009

申请日：1997-07-08

申请人： Takaaki Higashida ,  Koichi Kumagai ,  Takahiro Matsuo

发明人： Takaaki Higashida ,  Koichi Kumagai ,  Takahiro Matsuo

IPC分类号： H05K116

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49158 ,  H01L2924/00014

摘要： Conductive members formed of metallic wires constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member are integrally molded with the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

摘要翻译： 由金属线形成的导电构件与底座构件一体地模制在半导体元件安装面和基座构件的电路板安装面之间，直线延伸。 为此，将用于形成基材的树脂材料注射到其中导电构件预先线性排列的模具中。

公开(公告)号：US6165595A

公开(公告)日：2000-12-26

申请号：US973209

申请日：1998-02-09

申请人： Koichi Kumagai ,  Yoshinori Wada ,  Teruki Edahiro

发明人： Koichi Kumagai ,  Yoshinori Wada ,  Teruki Edahiro

IPC分类号： H05K1/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34 ,  B32B3/00

CPC分类号： H05K3/202 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/10575 ,  H05K2203/0264 ,  H05K2203/063 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T428/24917

摘要： A parts-packaging substrate comprising a metal wiring plate having a mask coated on its surface with several openings. This structure eliminates the need for a thick base formed of an insulating body and a resist layer required in prior art substrates. By bending a terminal of the metal wiring plate to form a connecting terminal, a connector used to connect to another substrate can be eliminated, reducing the cost of manufacture.

摘要翻译： PCT No.PCT / JP97 / 01189 Sec。 371日期：1998年2月9日 102（e）1998年2月9日PCT PCT 1997年4月7日提交PCT公布。 出版物WO97 / 38562 日期1997年10月16日一种包括具有在其表面上涂覆有多个开口的掩模的金属布线板的部件包装基板。 这种结构消除了对现有技术基板所需的绝缘体和抗蚀剂层形成的厚基底的需要。 通过弯曲金属布线板的端子以形成连接端子，可以消除用于连接到另一个基板的连接器，从而降低了制造成本。

公开(公告)号：US20130026509A1

公开(公告)日：2013-01-31

申请号：US13640869

申请日：2011-04-14

申请人： Naoya Tohyama ,  Takuya Inoue ,  Koichi Kumagai ,  Takaha Kunieda

发明人： Naoya Tohyama ,  Takuya Inoue ,  Koichi Kumagai ,  Takaha Kunieda

IPC分类号： H01L33/08 ,  H01L33/64 ,  H01L33/62

CPC分类号： H01L25/167 ,  F21K9/23 ,  F21V3/00 ,  F21Y2115/10 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/10106 ,  H05K2201/10378 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.

摘要翻译： 本发明包括一个或多个LED元件，通过微型凸块安装LED元件的硅衬底，并且内部形成的布线连接到微型突起，与LED元件的相对侧粘贴的隔热有机衬底， 硅基板的安装侧，并且具有布线穿过的通孔，粘贴在隔热有机基板的硅基板侧的相反侧的芯片安装基板和内部形成的布线连接到布线 隔热有机基板的通孔，以及通过微型突起与芯片安装基板的布线连接的LED控制电路芯片，并且经由隔热有机基板侧的相反侧的微凸块安装 的芯片安装基板。

公开(公告)号：US06496957B1

公开(公告)日：2002-12-17

申请号：US09265565

申请日：1999-03-10

申请人： Koichi Kumagai

发明人： Koichi Kumagai

IPC分类号： G06F1750

CPC分类号： G06F17/50 ,  G05B2219/35027 ,  G05B2219/36195 ,  Y02P90/265

摘要： The invention provides a design evaluating method for assisting circuit-board-assembly, as well as an evaluation apparatus, for realizing high-quality, low-cost assembly by numerically evaluating any difference between targeted circuit design and actually performed circuit design, and further provides a recording medium having recorded thereon programs for executing the design evaluating method for assisting circuit-board-assembly. Concretely, an evaluation executing unit is provided and, after reading design evaluation programs from recording media on which the design evaluating programs have been recorded and prior to engineering-trial manufacture of a component-mounted-circuit board mounted components on the circuit board, at least one of a first design evaluation and a second design evaluation is executed. Accordingly, it is enabled to evaluate the appropriateness of a present circuit design before the engineering-trial manufacture, and thus high-quality, low-cost assembly can be realized.

摘要翻译： 本发明提供了一种用于辅助电路板组装的设计评估方法以及评估装置，用于通过数字评估目标电路设计和实际执行的电路设计之间的差异来实现高质量，低成本的组装，并进一步提供 其中记录有用于执行用于辅助电路板组装的设计评估方法的程序的记录介质。 具体地，提供评估执行单元，并且在从已经记录了设计评估程序的记录介质读取设计评估程序之后，以及在将电路板上的部件安装电路板安装的部件进行工程试制之前，在 执行第一设计评估和第二设计评估中的至少一个。 因此，能够在工程试制前对电路设计的适用性进行评价，从而能够实现高质量，低成本的组装。

公开(公告)号：US5443382A

公开(公告)日：1995-08-22

申请号：US148494

申请日：1993-11-08

申请人： Koichi Tsurumi ,  Shinji Shimazaki ,  Koichi Kumagai

发明人： Koichi Tsurumi ,  Shinji Shimazaki ,  Koichi Kumagai

IPC分类号： F27B9/02 ,  F27B9/10 ,  F27D3/00 ,  F27D99/00 ,  F27B9/28

CPC分类号： F27B9/028 ,  F27B9/10 ,  F27D2003/0004 ,  F27D99/007

摘要： An atmospheric oven containing an atmospheric gas kept at a predetermined purity accommodates a transport for transporting an object to be heated along a predetermined transporting path. A rectangular sectioned tubular body for preventing the gas from flowing outside the oven extends a certain length from an entrance of the oven and an exit of the oven and has a sectional area necessary for passing the object through the tubular body.

摘要翻译： 包含保持在预定纯度的气氛气体的大气炉容纳沿着预定的输送路径输送被加热物的输送装置。 用于防止气体在炉外流动的矩形截面管状体从炉的入口和烘箱的出口延伸一定长度，并具有使物体通过管状体所需的截面面积。

公开(公告)号：US5118556A

公开(公告)日：1992-06-02

申请号：US593020

申请日：1990-10-03

申请人： Yutaka Makino ,  Kazumi Ishimoto ,  Koichi Kumagai ,  Yasuo Izumi

发明人： Yutaka Makino ,  Kazumi Ishimoto ,  Koichi Kumagai ,  Yasuo Izumi

IPC分类号： H01L23/50 ,  H01L21/00 ,  H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H05K3/02

CPC分类号： H01L21/67132 ,  H01L23/49572 ,  H01L23/4985 ,  H05K3/027 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T428/24917

摘要： A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion. A method for manufacturing the film carrier includes the steps of forming a conductive layer of material on a film; forming the lead pattern by etching part of the layer formed on the film into an outer lead portion having a pattern independent of the electrode arrangement of each semiconductor chip to be mounted thereon, and by leaving another part of the layer as it is to form an inner lead formation portion having a pattern which is changeable according to the electrode arrangement of the semiconductor chip to be mounted thereon; and selectively removing part of the inner lead formation portion by laser processing in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon.

摘要翻译： 用于制造薄膜载体的薄膜材料具有引线图案，其包括独立于要安装在薄膜载体上的半导体芯片的电极布置而形成的外部引线部分，以及内部引线形成部分，其一部分可选择性地移除 根据要安装在其上的半导体芯片的电极布置，内引线形成部分邻接并连接到外引线部分的相应引线。 制造薄膜载体的方法包括以下步骤：在薄膜上形成材料的导电层; 通过将形成在膜上的层的一部分蚀刻到具有独立于要安装在其上的每个半导体芯片的电极布置的图案的外引线部分中，并且通过使层的另一部分原样形成来形成引线图案 内引线形成部，其具有根据要安装在其上的半导体芯片的电极布置而可改变的图案; 并且根据要安装在其上的半导体芯片的电极布置，通过激光加工选择性地去除内部引线形成部分的一部分。

公开(公告)号：US07036221B2

公开(公告)日：2006-05-02

申请号：US10781759

申请日：2004-02-20

申请人： Takaaki Higashida ,  Koichi Kumagai ,  Takahiro Matsuo

发明人： Takaaki Higashida ,  Koichi Kumagai ,  Takahiro Matsuo

IPC分类号： H01K3/22

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49158 ,  H01L2924/00014

摘要： A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

摘要翻译： 一种半导体安装板的制造方法，其特征在于，具备由金属线构成的基材和线状的导电性构件。 导电构件被构造成使得它们在半导体元件安装面和基底构件的电路板安装面之间线性地延伸，并且一体地模制在基底构件内。 为此，将用于形成基材的树脂材料注射到其中导电构件预先线性排列的模具中。

公开(公告)号：US5686353A

公开(公告)日：1997-11-11

申请号：US576160

申请日：1995-12-21

申请人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

发明人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14

摘要： An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.

摘要翻译： 设置在半导体芯片（4）的表面上的电极端子（5）在平面图中具有正方形形状。 此外，设置在电极端子（5）上的突起（8）的突出顶部（8a）定向到电极端子（5）的角部（5a）。 因此，通过熔化通过毛细管（1）供给的金线（2）的下端部形成的金球（2a）与电极端子（5）接合，然后将毛细管（1）移动到 方形电极（5）的对角线方向。 因此，金线（2）的主要部分与金球（2a）分离，从而形成凸块（8）。

公开(公告)号：US5370531A

公开(公告)日：1994-12-06

申请号：US935987

申请日：1992-08-27

申请人： Koichi Tsurumi ,  Shinji Shimazaki ,  Koichi Kumagai

发明人： Koichi Tsurumi ,  Shinji Shimazaki ,  Koichi Kumagai

IPC分类号： F27B9/02 ,  F27B9/10 ,  F27D3/00 ,  F27D99/00 ,  F27D1/18

CPC分类号： F27B9/10 ,  F27B9/028 ,  F27D2003/0004 ,  F27D99/007

摘要： An atmospheric oven containing an atmospheric gas kept at a predetermined purity and accommodates a transporting means for transport an object to be heated along a predetermined transporting path. A includes a cylindrical portion for preventing the gas from flowing outside the oven, extends in a certain length from an entrance of the oven and an exit of the oven and has a sectional area necessary for passing the object through the portion.

摘要翻译： 一种含有保持预定纯度的大气气体的大气炉，并容纳用于沿着预定的输送路径输送被加热物的输送机构。 A包括用于防止气体在炉外流动的圆柱形部分，其从烤箱的入口和烘箱的出口延伸一定长度，并具有使物体通过该部分所需的截面面积。