公开(公告)号：USD927071S1

公开(公告)日：2021-08-03

申请号：US29697713

申请日：2019-07-10

Applicant: National Chung-Shan Institute of Science and Technology

Designer： Chun-Wei Chiu ,  Teh-Long Lai ,  Shyh-Chi Wu

公开(公告)号：US20190308348A1

公开(公告)日：2019-10-10

申请号：US16378567

申请日：2019-04-09

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Chun-Wei Chiu ,  Teh-Long Lai ,  Shyh-Chi Wu

IPC: B29C44/34 ,  F41H1/02 ,  C08L23/06 ,  C08L23/08 ,  C08K3/013 ,  C08L53/00 ,  B29C44/56 ,  C08K3/36 ,  C08K5/10 ,  C08L9/06

Abstract: The present invention provides an anti-shock pad, which includes: a board-shaped compound material structure, manufactured by mixing a composition and foam molding the composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40. The present invention is also related to a method of manufacturing the anti-shock pad.

公开(公告)号：US10913188B2

公开(公告)日：2021-02-09

申请号：US16378567

申请日：2019-04-09

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Chun-Wei Chiu ,  Teh-Long Lai ,  Shyh-Chi Wu

IPC: C08L23/06 ,  B29C44/34 ,  C08L9/06 ,  F41H1/02 ,  C08L23/08 ,  C08K3/013 ,  C08L53/00 ,  C08K3/36 ,  C08K5/10 ,  B29C44/56

Abstract: The present invention provides an anti-shock pad, which includes: a board-shaped compound material structure, manufactured by mixing a composition and foam molding the composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40. The present invention is also related to a method of manufacturing the anti-shock pad.