公开(公告)号：US20160148917A1

公开(公告)日：2016-05-26

申请号：US15011515

申请日：2016-01-30

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Yang-Kuo Kuo ,  Chia-Yi Hsiang ,  Hung-Tai Ku

IPC: H01L25/16 ,  H01L33/64 ,  H01L35/02

CPC classification number: H01L25/167 ,  F25B21/02 ,  H01L25/162 ,  H01L33/642 ,  H01L35/02 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling device for electronic components is a combination of substrate (aluminum nitride substrate—thermoelectric elements—aluminum nitride substrate) and utilizing the temperature difference generated by two top and bottom ends of the cooling device to effectively remove the heat generated by the electronic components. This cooling device not only can effectively reduce temperature of the electronic components, but also store the power generated through its thermoelectric effect.

Abstract translation: 电子部件的冷却装置是基板（氮化铝基板 - 热电元件 - 氮化铝基板）的组合，并且利用由冷却装置的两个顶端和底端产生的温差来有效地去除由电子部件产生的热量。 该冷却装置不仅能够有效地降低电子部件的温度，还可以存储通过其热电效应产生的电力。