公开(公告)号：US20200325294A1

公开(公告)日：2020-10-15

申请号：US16809804

申请日：2020-03-05

申请人： NATIONAL UNIVERSITY CORPORATION, IWATE UNIVERSITY

发明人： Hiroki MURAOKA ,  Satoshi Ogawa

IPC分类号： C08J7/12 ,  C23C18/30

摘要： There are provided a reactivity-introduced compound that imparts reactivity capable of bonding of a solid to another material, can perform imparting to a solid with high efficiency, and has high adhesion of bonding, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.There are provided a reactivity-introduced compound provided on a surface of the solid for bonding the solid to another material, the reactivity-introduced compound including a triazine ring, an alkoxysilyl group (including a case where an alkoxy group in the alkoxysilyl group is OH), and a diazomethyl group in one molecule, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.

公开(公告)号：US20240295028A1

公开(公告)日：2024-09-05

申请号：US18572323

申请日：2022-06-21

申请人： National University Corporation, Iwate University

发明人： Jing SANG ,  Hiroki MURAOKA ,  Hidetoshi HIRAHARA

IPC分类号： C23C18/18 ,  C03C17/10 ,  C23C18/16 ,  C23C18/32

CPC分类号： C23C18/1893 ,  C03C17/10 ,  C23C18/1639 ,  C23C18/1868 ,  C23C18/32 ,  C03C2217/261 ,  C03C2218/111 ,  C03C2218/31

摘要： Provided is a production method for a plated substrate, comprising: providing a photoreactive bonding agent on a surface of a substrate made of glass or silicon; irradiating the surface of the substrate, on which the photoreactive bonding agent is provided, with light to allow the surface of the substrate and the photoreactive bonding agent to be bonded to each other; after the irradiation, removing by washing the photoreactive bonding agent that is not bonded to the surface of the substrate; after the first washing, providing a catalyst that binds to the photoreactive bonding agent; after the catalyst provision, removing by washing the catalyst that does not bind to the photoreactive bonding agent; and disposing a conductive substance on the photoreactive bonding agent by an electroless plating process after the second washing, the catalyst binding to the photoreactive bonding agent.