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公开(公告)号:US20120189782A1
公开(公告)日:2012-07-26
申请号:US13358462
申请日:2012-01-25
申请人: Nicholas A Zafiropoulos , Paul Nahass , Roxana Trifu , Redouane Begag , Wendell E Rhine , Wenting Dong , Shannon White , George L Gould , Alaric Naiman , Roger Sinta
发明人: Nicholas A Zafiropoulos , Paul Nahass , Roxana Trifu , Redouane Begag , Wendell E Rhine , Wenting Dong , Shannon White , George L Gould , Alaric Naiman , Roger Sinta
CPC分类号: H01L23/5329 , C08L79/08 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/31058 , H01L2924/0002 , H01L2924/00
摘要: Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.
摘要翻译: 描述了使用包含聚酰亚胺基气凝胶的低介电材料制造电子器件和半导体部件的材料和方法。 还提供了用于操纵介电材料的性质并影响系统的整体介电性能的附加方法。