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公开(公告)号:US06191494B1
公开(公告)日:2001-02-20
申请号:US09342500
申请日:1999-06-29
申请人: Nobuo Ooyama , Shinichiro Maki , Fumitoshi Fujisaki , Syunichi Kuramoto , Yukio Saigo , Yasuo Yatsuda , Youichi Matae , Atsushi Yano , Kazuto Tsuji , Masafumi Tetaka
发明人: Nobuo Ooyama , Shinichiro Maki , Fumitoshi Fujisaki , Syunichi Kuramoto , Yukio Saigo , Yasuo Yatsuda , Youichi Matae , Atsushi Yano , Kazuto Tsuji , Masafumi Tetaka
IPC分类号: H01L2328
CPC分类号: H01L21/568 , H01L23/3107 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/85399 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H05K3/20 , H05K3/4007 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要: A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.
摘要翻译: 提供半导体器件及其制造方法。 半导体器件包括:半导体芯片; 密封半导体芯片的树脂封装; 信号通道,其将半导体芯片的信号端子从树脂封装向外引导; 与半导体芯片的底面接触的接地金属膜; 以及连接到接地金属膜并从树脂封装向外引导的接地通道。