Thin-film transistor and method of manufacturing same
    1.
    发明授权
    Thin-film transistor and method of manufacturing same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US09153703B2

    公开(公告)日:2015-10-06

    申请号:US12527622

    申请日:2008-02-08

    摘要: There is provided a thin-film transistor including at least a substrate, a gate electrode, a gate insulating layer, an oxide semiconductor layer, a source electrode, a drain electrode and a protective layer, wherein the oxide semiconductor layer is an amorphous oxide containing at least one of the elements In, Ga and Zn, the gate electrode-side carrier density of the oxide semiconductor layer is higher than the protective layer-side carrier density thereof, and the film thickness of the oxide semiconductor layer is 30 nm±15 nm.

    摘要翻译: 提供了至少包括衬底,栅电极,栅极绝缘层,氧化物半导体层,源电极,漏电极和保护层的薄膜晶体管,其中氧化物半导体层是含有 元素In,Ga和Zn中的至少一种,氧化物半导体层的栅电极侧载流子密度高于其保护层侧载流子密度,氧化物半导体层的膜厚为30nm±15 nm。

    THIN-FILM TRANSISTOR AND METHOD OF MANUFACTURING SAME
    2.
    发明申请
    THIN-FILM TRANSISTOR AND METHOD OF MANUFACTURING SAME 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20100051937A1

    公开(公告)日:2010-03-04

    申请号:US12527622

    申请日:2008-02-08

    IPC分类号: H01L29/786 H01L33/00

    摘要: There is provided a thin-film transistor including at least a substrate, a gate electrode, a gate insulating layer, an oxide semiconductor layer, a source electrode, a drain electrode and a protective layer, wherein the oxide semiconductor layer is an amorphous oxide containing at least one of the elements In, Ga and Zn, the gate electrode-side carrier density of the oxide semiconductor layer is higher than the protective layer-side carrier density thereof, and the film thickness of the oxide semiconductor layer is 30 nm±15 nm.

    摘要翻译: 提供了至少包括衬底,栅电极,栅极绝缘层,氧化物半导体层,源电极,漏电极和保护层的薄膜晶体管,其中氧化物半导体层是含有 元素In,Ga和Zn中的至少一种,氧化物半导体层的栅电极侧载流子密度高于其保护层侧载流子密度,氧化物半导体层的膜厚为30nm±15 nm。

    Method for manufacturing field-effect transistor
    3.
    发明授权
    Method for manufacturing field-effect transistor 有权
    制造场效应晶体管的方法

    公开(公告)号:US08110436B2

    公开(公告)日:2012-02-07

    申请号:US12671054

    申请日:2008-09-25

    IPC分类号: H01L21/00

    摘要: A method for manufacturing a field-effect transistor is provided. The field-effect transistor includes on a substrate a source electrode, a drain electrode, an oxide semiconductor layer, an insulating layer and a gate electrode. The method includes, after forming the insulating layer on the oxide semiconductor layer, an annealing step of increasing the electrical conductivity of the oxide semiconductor layers by annealing in an atmosphere containing moisture. The steam pressure at the annealing step is higher than the saturated vapor pressure in the atmosphere at the annealing temperature.

    摘要翻译: 提供一种用于制造场效晶体管的方法。 场效应晶体管在基板上包括源电极,漏电极,氧化物半导体层,绝缘层和栅电极。 该方法包括:在氧化物半导体层上形成绝缘层之后,通过在含有水分的气氛中进行退火来提高氧化物半导体层的导电性的退火步骤。 退火步骤中的蒸汽压力高于退火温度下大气中的饱和蒸气压。

    BOTTOM GATE TYPE THIN FILM TRANSISTOR, METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS
    5.
    发明申请
    BOTTOM GATE TYPE THIN FILM TRANSISTOR, METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS 有权
    底盖型薄膜晶体管,其制造方法和显示装置

    公开(公告)号:US20100051936A1

    公开(公告)日:2010-03-04

    申请号:US12515268

    申请日:2007-11-20

    CPC分类号: H01L29/7869 H01L27/1225

    摘要: Provided is a bottom gate type thin film transistor including on a substrate (1) a gate electrode (2), a first insulating film (3) as a gate insulating film, an oxide semiconductor layer (4) as a channel layer, a second insulating film (5) as a protective layer, a source electrode (6), and a drain electrode (7), in which the oxide semiconductor layer (4) includes an oxide including at least one selected from the group consisting of In, Zn, and Sn, and the second insulating film (5) includes an amorphous oxide insulator formed so as to be in contact with the oxide semiconductor layer (4) and contains therein 3.8×1019 molecules/cm3 or more of a desorbed gas observed as oxygen by temperature programmed desorption mass spectrometry.

    摘要翻译: 提供了一种底栅型薄膜晶体管,其包括:基板(1),栅电极(2),作为栅极绝缘膜的第一绝缘膜(3),作为沟道层的氧化物半导体层(4),第二 作为保护层的绝缘膜(5),源电极(6)和漏电极(7),其中氧化物半导体层(4)包括含有选自In,Zn 和Sn,并且第二绝缘膜(5)包括形成为与氧化物半导体层(4)接触的非晶形氧化物绝缘体,并且其中包含观察为氧的解吸气体的3.8×1019分子/ cm 3以上 通过温度程序解吸质谱。

    X-ray detector and method for manufacturing the same
    7.
    发明授权
    X-ray detector and method for manufacturing the same 有权
    X射线检测器及其制造方法

    公开(公告)号:US08487266B2

    公开(公告)日:2013-07-16

    申请号:US12984515

    申请日:2011-01-04

    IPC分类号: G01T1/24

    CPC分类号: G01T1/2928 H01L31/085

    摘要: An X-ray detector includes an X-ray photoelectric conversion layer configured to produce electric charges in proportion to X-ray irradiation incident on the layer, a collecting electrode configured to collect the electric charges produced by the X-ray photoelectric conversion layer, a common electrode disposed on a surface of the X-ray photoelectric conversion layer opposite to the collecting electrode, a storage capacitor configured to store the electric charges collected by the collecting electrode, and a readout unit configured to read out the electric charges stored in the storage capacitor. A voltage is to be applied between the collecting electrode and the common electrode. The X-ray photoelectric conversion layer is formed of a polycrystalline oxide.

    摘要翻译: X射线检测器包括:X射线光电转换层,被配置为与入射在该层上的X射线照射成比例地产生电荷;收集电极,被配置为收集由X射线光电转换层产生的电荷; 配置在与集电电极相反的X射线光电转换层的表面上的公共电极,配置为存储由集电极收集的电荷的存储电容器,以及读出单元,其被配置为读出存储在存储器中的电荷 电容器。 在集电极和公共电极之间施加电压。 X射线光电转换层由多晶氧化物形成。

    BOTTOM GATE TYPE THIN FILM TRANSISTOR, METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS
    8.
    发明申请
    BOTTOM GATE TYPE THIN FILM TRANSISTOR, METHOD OF MANUFACTURING THE SAME, AND DISPLAY APPARATUS 审中-公开
    底盖型薄膜晶体管,其制造方法和显示装置

    公开(公告)号:US20120168750A1

    公开(公告)日:2012-07-05

    申请号:US13419417

    申请日:2012-03-13

    IPC分类号: H01L27/15 H01L29/786

    摘要: Provided is a bottom gate type thin film transistor including on a substrate (1) a gate electrode (2), a first insulating film (3) as a gate insulating film, an oxide semiconductor layer (4) as a channel layer, a second insulating film (5) as a protective layer, a source electrode (6), and a drain electrode (7), in which the oxide semiconductor layer (4) includes an oxide including at least one selected from the group consisting of In, Zn, and Sn, and the second insulating film (5) includes an amorphous oxide insulator formed so as to be in contact with the oxide semiconductor layer (4) and contains therein 3.8×1019 molecules/cm3 or more of a desorbed gas observed as oxygen by temperature programmed desorption mass spectrometry.

    摘要翻译: 提供了一种底栅型薄膜晶体管,其包括:基板(1),栅电极(2),作为栅极绝缘膜的第一绝缘膜(3),作为沟道层的氧化物半导体层(4),第二 作为保护层的绝缘膜(5),源电极(6)和漏电极(7),其中氧化物半导体层(4)包括含有选自In,Zn 和Sn,并且第二绝缘膜(5)包括形成为与氧化物半导体层(4)接触的非晶形氧化物绝缘体,并且其中包含观察为氧的解吸气体的3.8×1019分子/ cm 3以上 通过温度程序解吸质谱。

    Bottom gate type thin film transistor, method of manufacturing the same, and display apparatus
    9.
    发明授权
    Bottom gate type thin film transistor, method of manufacturing the same, and display apparatus 有权
    底栅型薄膜晶体管,其制造方法以及显示装置

    公开(公告)号:US08148721B2

    公开(公告)日:2012-04-03

    申请号:US12515268

    申请日:2007-11-20

    CPC分类号: H01L29/7869 H01L27/1225

    摘要: Provided is a bottom gate type thin film transistor including on a substrate (1) a gate electrode (2), a first insulating film (3) as a gate insulating film, an oxide semiconductor layer (4) as a channel layer, a second insulating film (5) as a protective layer, a source electrode (6), and a drain electrode (7), in which the oxide semiconductor layer (4) includes an oxide including at least one selected from the group consisting of In, Zn, and Sn, and the second insulating film (5) includes an amorphous oxide insulator formed so as to be in contact with the oxide semiconductor layer (4) and contains therein 3.8×1019 molecules/cm3 or more of a desorbed gas observed as oxygen by temperature programmed desorption mass spectrometry.

    摘要翻译: 提供了一种底栅型薄膜晶体管,其包括:基板(1),栅电极(2),作为栅极绝缘膜的第一绝缘膜(3),作为沟道层的氧化物半导体层(4),第二 作为保护层的绝缘膜(5),源电极(6)和漏电极(7),其中氧化物半导体层(4)包括含有选自In,Zn 和Sn,并且第二绝缘膜(5)包括形成为与氧化物半导体层(4)接触的非晶形氧化物绝缘体,并且其中包含观察为氧的解吸气体的3.8×1019分子/ cm 3以上 通过温度程序解吸质谱。

    METHOD FOR MANUFACTURING FIELD-EFFECT TRANSISTOR
    10.
    发明申请
    METHOD FOR MANUFACTURING FIELD-EFFECT TRANSISTOR 有权
    制造场效应晶体管的方法

    公开(公告)号:US20100203673A1

    公开(公告)日:2010-08-12

    申请号:US12671054

    申请日:2008-09-25

    IPC分类号: H01L21/34

    摘要: A method for manufacturing a field-effect transistor is provided. The field-effect transistor includes on a substrate a source electrode, a drain electrode, an oxide semiconductor layer, an insulating layer and a gate electrode. The method includes, after forming the insulating layer on the oxide semiconductor layer, an annealing step of increasing the electrical conductivity of the oxide semiconductor layers by annealing in an atmosphere containing moisture. The steam pressure at the annealing step is higher than the saturated vapor pressure in the atmosphere at the annealing temperature.

    摘要翻译: 提供一种用于制造场效晶体管的方法。 场效应晶体管在基板上包括源电极,漏电极,氧化物半导体层,绝缘层和栅电极。 该方法包括:在氧化物半导体层上形成绝缘层之后,通过在含有水分的气氛中进行退火来提高氧化物半导体层的导电性的退火步骤。 退火步骤中的蒸汽压力高于退火温度下大气中的饱和蒸气压。