公开(公告)号：US20190198417A1

公开(公告)日：2019-06-27

申请号：US16261607

申请日：2019-01-30

Applicant: Novatek Microelectronics Corp.

Inventor： Wen-Ching Huang ,  Chien-Chen Ko ,  Ling-Chieh Li

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  B32B37/12 ,  B32B9/00 ,  B32B7/12 ,  B32B37/14

CPC classification number: H01L23/373 ,  B32B7/12 ,  B32B9/007 ,  B32B37/12 ,  B32B37/14 ,  B32B2457/00 ,  H01L21/481 ,  H01L23/3142 ,  H01L23/315 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225

Abstract: A chip on film package includes a base film, a patterned circuit layer, a chip and a heat dissipation sheet. The base film includes a first surface and a mounting region located on the first surface. The patterned circuit layer is disposed on the first surface. The chip is disposed on the mounting region and electrically connected to the patterned circuit layer. The heat dissipation sheet includes a first adhesive layer disposed over the base film, a second adhesive layer disposed over the first adhesive layer, and a graphite layer disposed between the first adhesive layer and the second adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer is a double-sided adhesive with carrier, which comprises two adhesives and a carrier disposed between the two adhesives.

公开(公告)号：US20200321300A1

公开(公告)日：2020-10-08

申请号：US16910085

申请日：2020-06-24

Applicant: Novatek Microelectronics Corp.

Inventor： Ling-Chieh Li ,  Chiao-Ling Huang

IPC: H01L23/00

Abstract: A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.

公开(公告)号：US10734344B2

公开(公告)日：2020-08-04

申请号：US16030864

申请日：2018-07-10

Applicant: Novatek Microelectronics Corp.

Inventor： Ling-Chieh Li ,  Chiao-Ling Huang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

Abstract: A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.

公开(公告)号：US11502052B2

公开(公告)日：2022-11-15

申请号：US16910085

申请日：2020-06-24

Applicant: Novatek Microelectronics Corp.

Inventor： Ling-Chieh Li ,  Chiao-Ling Huang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

Abstract: A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.

公开(公告)号：US10418305B2

公开(公告)日：2019-09-17

申请号：US16261607

申请日：2019-01-30

Applicant: Novatek Microelectronics Corp.

Inventor： Wen-Ching Huang ,  Chien-Chen Ko ,  Ling-Chieh Li

IPC: H01L23/373 ,  B32B7/12 ,  B32B37/14 ,  H01L23/367 ,  B32B9/00 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  B32B37/12 ,  H01L23/498

Abstract: A chip on film package includes a base film, a patterned circuit layer, a chip and a heat dissipation sheet. The base film includes a first surface and a mounting region located on the first surface. The patterned circuit layer is disposed on the first surface. The chip is disposed on the mounting region and electrically connected to the patterned circuit layer. The heat dissipation sheet includes a first adhesive layer disposed over the base film, a second adhesive layer disposed over the first adhesive layer, and a graphite layer disposed between the first adhesive layer and the second adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer is a double-sided adhesive with carrier, which comprises two adhesives and a carrier disposed between the two adhesives.

公开(公告)号：US20190198473A1

公开(公告)日：2019-06-27

申请号：US16030864

申请日：2018-07-10

Applicant: Novatek Microelectronics Corp.

Inventor： Ling-Chieh Li ,  Chiao-Ling Huang

IPC: H01L23/00

Abstract: A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.