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公开(公告)号:US12298825B2
公开(公告)日:2025-05-13
申请号:US16653095
申请日:2019-10-15
Applicant: Nvidia Corporation
Inventor: Qi Lin , David Haley , Chad Plummer , Hans Schulze , Darryl Moore
IPC: G06F1/20 , G01K7/42 , G01M99/00 , G05B19/404 , H05K7/20
Abstract: The disclosure provides a cooling solution that evaluates the thermal environment of a computer component based on transient thermal responses of the computer component. The transient thermal responses are generated by measuring the temperature rise of the computer component over a designated amount of time for multiple “good” assemblies and multiple “bad” assemblies to determine a duration and allowable temperature rise needed to set a pass/fail criteria for different failure modes of cooling devices. A cooling device may not be operating as designed due to damage, needed maintenance, missing thermal interface material (TIM), improper installation, etc. From the transient thermal responses, a thermal problem, such as a malfunctioning fan, can be determined and a corrective action can be performed.
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公开(公告)号:US10571978B2
公开(公告)日:2020-02-25
申请号:US14882363
申请日:2015-10-13
Applicant: NVIDIA CORPORATION
Inventor: David Haley , Hans Schulze
IPC: G06F1/20
Abstract: A fan control module configured to control the speed of a fan receives a signal that indicates the power used by a graphics processing unit (GPU) and a signal that indicates the GPU temperature. Whenever the GPU power exceeds a power threshold level, but the GPU temperature is below a temperature threshold level, the control module turns the fan on and causes the fan to operate at a minimum speed. Whenever the GPU temperature is above the temperature threshold, the control module causes the fan speed to increase with increasing temperature, regardless of power. The control module turns the fan off only when both the GPU temperature is below the temperature threshold and the GPU power is below the power threshold. Although the algorithm is discussed in conjunction with a GPU, the algorithm can be implemented with any type of processor or subsystem that needs to be fan-cooled.
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