公开(公告)号：US20170290497A1

公开(公告)日：2017-10-12

申请号：US15634109

申请日：2017-06-27

Applicant: OLYMPUS CORPORATION

Inventor： Yuichi WATAYA ,  Akira MURAMATSU ,  Yuki Nakayama

IPC: A61B1/05 ,  G02B7/02

CPC classification number: A61B1/00096 ,  A61B1/00 ,  A61B1/00188 ,  A61B1/05 ,  G02B7/02 ,  G02B23/2423 ,  G02B23/243 ,  G02B23/2438 ,  G02B23/2476

Abstract: To provide an image pickup unit that can prevent axis deviation of a movable lens barrel and obtain high-quality picked-up image, a stopper member is positioned and fixed in a state in which the stopper member is abutted against an outer circumferential surface of a rear group lens barrel, movement of a movable lens barrel to a retraction side along a photographing optical axis is restricted by contact of a stopper section of the stopper member and an operation rod, and a movable lens is held in a position for realizing a second focal length.

公开(公告)号：US20170296044A1

公开(公告)日：2017-10-19

申请号：US15633970

申请日：2017-06-27

Applicant: OLYMPUS CORPORATION

Inventor： Yuichi WATAYA ,  Akira MURAMATSU ,  Yukiharu MAKINO

IPC: A61B1/05 ,  H04N5/225 ,  A61B1/00

CPC classification number: A61B1/05 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/00163 ,  A61B1/00188 ,  A61B1/04 ,  G02B23/24 ,  H04N5/2254 ,  H04N5/2256

Abstract: An image pickup unit, includes: a front group lens frame holding a front group lens; a rear group lens frame fitted to the front group lens frame and holding a rear group lens; a movable frame disposed to be movable forward and backward in a direction along a photographing optical axis within the rear group lens frame, and holding a movable lens; an adhesive bonding the front group lens frame to the rear group lens frame; and an adhesive outflow preventing portion preventing the adhesive from flowing out toward the movable frame side when the front group lens frame is bonded and fitted to the rear group lens frame.

公开(公告)号：US20170265729A1

公开(公告)日：2017-09-21

申请号：US15609096

申请日：2017-05-31

Applicant: OLYMPUS CORPORATION

Inventor： Yuichi WATAYA ,  Akira MURAMATSU

IPC: A61B1/04 ,  A61B1/00 ,  G02B23/26

CPC classification number: A61B1/04 ,  A61B1/00009 ,  A61B1/00096 ,  A61B1/00163 ,  A61B1/00188 ,  A61B1/05 ,  G02B23/243 ,  G02B23/2484 ,  G02B23/26

Abstract: An image pickup unit includes: a focus switching type observation optical system including fixed lenses and a moving lens; fixed frames that hold the fixed lenses; a moving frame that is arranged to be movable back and forth in a direction along a photographing optical axis of the observation optical system and holds the moving lens; and a correction frame fixed in the fixed frames, configured to house the moving frame such that the moving frame can advance and retract, including a stopper that abuts the moving frame to restrict movement in one direction of the photographing optical axis, and being slightly adjustable to realize one of focal lengths of the observation optical system.

公开(公告)号：US20170164818A1

公开(公告)日：2017-06-15

申请号：US15442768

申请日：2017-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Shinya ISHIKAWA ,  Yuichi WATAYA ,  Akira MURAMATSU

IPC: A61B1/04 ,  G02B23/24 ,  H01L27/146 ,  H04N5/225 ,  A61B1/00 ,  H01L23/498

CPC classification number: H01L27/14618 ,  A61B1/00045 ,  A61B1/04 ,  A61B1/051 ,  G02B23/2484 ,  H01L23/04 ,  H01L23/041 ,  H01L23/053 ,  H01L23/12 ,  H01L23/32 ,  H01L23/488 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/538 ,  H01L27/146 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L31/0203 ,  H01L2924/0002 ,  H04N5/2256 ,  H04N2005/2255 ,  H01L2924/00

Abstract: An imaging unit includes: a semiconductor package having an image sensor and having a first connection electrode on a back face thereof; a first multi-layer substrate having layered substrates and having second and third connection electrodes respectively on front and back faces of the first multi-layer substrate, the second connection electrode being configured to be connected to the first connection electrode; a second multi-layer substrate having layered substrates, the second multi-layer substrate being configured to be connected to the back face of the first multi-layer substrate such that a layer direction of the second multi-layer substrate is perpendicular to a layer direction of the first multi-layer substrate; an electronic component mounted inside the first multi-layer substrate; and cables configured to be connected to the second multi-layer substrate. The first and second multi-layer substrates lie within a projected plane in an optical axis direction of the semiconductor package.