公开(公告)号：US11957313B2

公开(公告)日：2024-04-16

申请号：US17940208

申请日：2022-09-08

Applicant: OLYMPUS CORPORATION

Inventor： Kenjiro Kanno ,  Shigeru Hosokai ,  Takuro Horibe ,  Daichi Kodama ,  Hiroyuki Motohara

IPC: A61B1/04 ,  A61B1/00 ,  A61B1/05 ,  G02B23/24

CPC classification number: A61B1/04 ,  A61B1/00096 ,  A61B1/05 ,  G02B23/2423

Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

公开(公告)号：US11914138B2

公开(公告)日：2024-02-27

申请号：US17405574

申请日：2021-08-18

Applicant: OLYMPUS CORPORATION

Inventor： Daichi Kodama

IPC: A61B1/045 ,  G02B23/24 ,  H04N23/51 ,  H04N23/57 ,  H04N23/50

CPC classification number: G02B23/2484 ,  G02B23/2423 ,  G02B23/2461 ,  H04N23/51 ,  H04N23/57 ,  H04N23/555

Abstract: A distal end frame includes: a distal end frame body including a resin molded product; an image pickup unit housing chamber formed of a bottomed hole with an opening which is formed on a distal end surface of the distal end frame body; a through hole penetrating from a bottom face of the image pickup unit housing chamber to a proximal end side of the distal end frame body; a mounting face formed on the bottom face of the image pickup unit housing chamber; an inclined face that is formed in a region containing a part of an inner wall face of the through hole to be adjacent to the mounting face, and is visible through the opening; and a wiring pattern that is formed of the metal pattern constituting the molded interconnect device, and is continuously formed in a region containing the mounting face and the inclined face.

公开(公告)号：US12147025B2

公开(公告)日：2024-11-19

申请号：US18078305

申请日：2022-12-09

Applicant: OLYMPUS CORPORATION

Inventor： Daichi Kodama ,  Hiroyuki Motohara

IPC: G02B23/24 ,  A61B1/04

Abstract: An electronic module includes: a mount table including a first electrode mounting surface on which an electronic component is mounted; a plurality of electrode mount parts that are formed in the mount table and at which lands corresponding to a plurality of respective electrodes of the electronic component are formed on the first electrode mounting surface; a step part located between the plurality of electrode mount parts and including a predetermined step relative to the first electrode mounting surface of the mount table; and a solder withdrawing part at which an end part of a corresponding one of the lands is extended to the step part or a side surface of the mount table.

公开(公告)号：US12089811B2

公开(公告)日：2024-09-17

申请号：US17401821

申请日：2021-08-13

Applicant: OLYMPUS CORPORATION

Inventor： Shun Ogi ,  Daichi Kodama ,  Hiroyuki Motohara

IPC: A61B1/00

CPC classification number: A61B1/00096 ,  A61B1/00009 ,  A61B1/00114

Abstract: A distal end unit includes: an image pickup unit made using a wafer level optics technique; a distal end frame forming an external shape of an insertion portion, the distal end frame being constituted by a resin molded article; an image pickup unit containing room containing the image pickup unit in an interior of the distal end frame, the image pickup unit containing room including a first opening portion and a second opening portion that are continuously formed, the first opening portion being positioned on the distal end surface of the distal end frame, the second opening portion being positioned on a side surface of the distal end frame; and a filler having light blocking property, the image pickup unit containing room being filled with the filler, the filler forming the external shape of a distal end portion with the distal end frame.

公开(公告)号：US11963660B2

公开(公告)日：2024-04-23

申请号：US17401989

申请日：2021-08-13

Applicant: OLYMPUS CORPORATION

Inventor： Daichi Kodama ,  Hiroyuki Motohara ,  Hiroyuki Nagamizu

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/07 ,  G02B23/24

CPC classification number: A61B1/00096 ,  A61B1/051 ,  A61B1/07 ,  G02B23/243

Abstract: A distal end unit of an endoscope includes: a distal end frame body that is constituted by a resin molded article configuring a molded interconnect device, that is provided with an image pickup unit containing room, and that is provided with an observation opening portion that opens the image pickup unit containing room on a distal end surface exposed to an exterior; a metal layer that is provided along a flat surface of the observation opening portion; a cover glass that closes the observation opening portion; a solder layer that is bonded to the metal layer and that holds the cover glass on the distal end frame body; and an adhesive layer that covers the solder layer, the metal layer is provided at a position corresponding to a groove provided on the flat surface, and the solder layer is disposed in an interior of the groove.

公开(公告)号：US11957306B2

公开(公告)日：2024-04-16

申请号：US17475925

申请日：2021-09-15

Applicant: OLYMPUS CORPORATION

Inventor： Daichi Kodama ,  Tomokazu Yamashita ,  Takuro Horibe ,  Hiroyuki Motohara

IPC: A61B1/00

CPC classification number: A61B1/00114 ,  A61B1/00097 ,  A61B1/00124

Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.