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公开(公告)号：US12127732B2
公开(公告)日：2024-10-29
申请号：US17495204
申请日：2021-10-06
Applicant: OLYMPUS CORPORATION
Inventor： Takuro Horibe , Hiroyuki Motohara , Kenjiro Kanno
CPC classification number: A61B1/051 , A61B1/00018 , A61B1/00096 , A61B1/05
Abstract: A distal end unit for endoscope is provided in a distal end portion of an insertion portion and includes: an electronic module including an optical system and an electrode; a substrate including a connection portion electrically connected to the electrode of the electronic module, and including a connection land on which an electronic component is mounted; a holding member holding the electronic module and the substrate connected to the electrode; and a distal end frame body made of resin, on which the electronic module, the substrate and the holding member are integrally mounted via insert molding by loading the holding member holding the electronic module and the substrate in a mold such that an entrance surface of the optical system is exposed at an outer surface of the distal end frame body and the connection portion extends to a proximal end side.
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公开(公告)号：US11963660B2
公开(公告)日：2024-04-23
申请号：US17401989
申请日：2021-08-13
Applicant: OLYMPUS CORPORATION
Inventor： Daichi Kodama , Hiroyuki Motohara , Hiroyuki Nagamizu
CPC classification number: A61B1/00096 , A61B1/051 , A61B1/07 , G02B23/243
Abstract: A distal end unit of an endoscope includes: a distal end frame body that is constituted by a resin molded article configuring a molded interconnect device, that is provided with an image pickup unit containing room, and that is provided with an observation opening portion that opens the image pickup unit containing room on a distal end surface exposed to an exterior; a metal layer that is provided along a flat surface of the observation opening portion; a cover glass that closes the observation opening portion; a solder layer that is bonded to the metal layer and that holds the cover glass on the distal end frame body; and an adhesive layer that covers the solder layer, the metal layer is provided at a position corresponding to a groove provided on the flat surface, and the solder layer is disposed in an interior of the groove.
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公开(公告)号：US11957306B2
公开(公告)日：2024-04-16
申请号：US17475925
申请日：2021-09-15
Applicant: OLYMPUS CORPORATION
Inventor： Daichi Kodama , Tomokazu Yamashita , Takuro Horibe , Hiroyuki Motohara
IPC: A61B1/00
CPC classification number: A61B1/00114 , A61B1/00097 , A61B1/00124
Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.
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公开(公告)号：US10362929B2
公开(公告)日：2019-07-30
申请号：US15799290
申请日：2017-10-31
Applicant: OLYMPUS CORPORATION
Inventor： Hiroyuki Motohara , Yasuhiro Kusano
Abstract: An imaging unit includes: a semiconductor package including an image sensor and a connection electrode; a circuit board including a main body including a connection land, and an attachment portion protruding on a back surface of the main body and including cable connection electrodes formed on at least two opposing side surfaces; electronic components mounted on an electronic component mounting area on the back surface; and cables electrically and mechanically connected to the cable connection electrodes of the attachment portion. The attachment portion protrudes from the main body such that a center plane of the two side surfaces is shifted from a center plane of side surfaces parallel to the two side surfaces, and at least one side surface is perpendicular to the back surface of the main body. The electronic component mounting area is arranged on the back surface of the main body side-by-side with the attachment portion.
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公开(公告)号：US10321805B2
公开(公告)日：2019-06-18
申请号：US15860884
申请日：2018-01-03
Applicant: OLYMPUS CORPORATION
Inventor： Hiroyuki Motohara , Yasuhiro Kusano
IPC: H04N5/225 , A61B1/00 , A61B1/04 , G02B23/26 , H01L27/14 , A61B1/06 , A61B1/05 , A61B1/005 , G02B23/24 , H01L27/146
Abstract: An imaging unit includes: an optical system; a semiconductor package including an image sensor, and a connection electrode formed on a back surface; a cable; an electronic component; and a multi-layer substrate having a rectangular plate shape and including: a first electrode and a second electrode arranged side-by-side with each other on a front surface, the semiconductor package being mounted on the first electrode, and the cable being connected to the second electrode; and a third electrode on a back surface, the electronic component being mounted on the third electrode. The multi-layer substrate includes walls on at least two opposing sides of the back surface, and the semiconductor package is disposed such that a light receiving surface of the image sensor is arranged horizontally with respect to the multi-layer substrate.
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Patent Agency Ranking
6.发明授权Optical element module, optical transmission module, and method of manufacturing optical transmission module 有权光元件模块，光传输模块，以及制造光传输模块的方法公开(公告)号：US09385249B2
公开(公告)日：2016-07-05
申请号：US14104345
申请日：2013-12-12
Applicant: OLYMPUS CORPORATION
Inventor： Hiroyuki Motohara
CPC classification number: H01L31/02325 , A61B1/00013 , G02B6/3644 , G02B6/4202 , G02B6/4239 , G02B6/4257 , H01L33/58 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01S5/02252 , H01S5/02284 , H01S5/183 , H01L2924/00014 , H01L2924/00
Abstract: An optical element module includes an optical element having a light receiving unit configured to input an optical signal or a light emitting unit configured to output an optical signal, a board on which the optical element is mounted, and a guide holding member that has a through hole into which an optical fiber is configured to be inserted for inputting and outputting the optical signal to or from the light receiving unit or the light emitting unit of the optical element, and is mounted and arranged to be aligned with the optical element in a thickness direction of the board. The through hole has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber. A diameter of the light receiving unit or the light emitting unit is smaller than that of the optical fiber.
Abstract translation: 光学元件模块包括光学元件，其具有被配置为输入光信号的光接收单元或被配置为输出光信号的发光单元，安装有光学元件的基板，以及导向保持构件， 孔，光纤被配置为插入其中以将光信号输入到光接收单元或光元件的发光单元，并且被安装和布置成与光学元件对准，厚度为 董事会的方向。 通孔具有圆筒形状并且具有与光纤的外径基本相同的直径。 光接收单元或发光单元的直径小于光纤的直径。
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公开(公告)号：US12147025B2
公开(公告)日：2024-11-19
申请号：US18078305
申请日：2022-12-09
Applicant: OLYMPUS CORPORATION
Inventor： Daichi Kodama , Hiroyuki Motohara
Abstract: An electronic module includes: a mount table including a first electrode mounting surface on which an electronic component is mounted; a plurality of electrode mount parts that are formed in the mount table and at which lands corresponding to a plurality of respective electrodes of the electronic component are formed on the first electrode mounting surface; a step part located between the plurality of electrode mount parts and including a predetermined step relative to the first electrode mounting surface of the mount table; and a solder withdrawing part at which an end part of a corresponding one of the lands is extended to the step part or a side surface of the mount table.
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公开(公告)号：US12089811B2
公开(公告)日：2024-09-17
申请号：US17401821
申请日：2021-08-13
Applicant: OLYMPUS CORPORATION
Inventor： Shun Ogi , Daichi Kodama , Hiroyuki Motohara
IPC: A61B1/00
CPC classification number: A61B1/00096 , A61B1/00009 , A61B1/00114
Abstract: A distal end unit includes: an image pickup unit made using a wafer level optics technique; a distal end frame forming an external shape of an insertion portion, the distal end frame being constituted by a resin molded article; an image pickup unit containing room containing the image pickup unit in an interior of the distal end frame, the image pickup unit containing room including a first opening portion and a second opening portion that are continuously formed, the first opening portion being positioned on the distal end surface of the distal end frame, the second opening portion being positioned on a side surface of the distal end frame; and a filler having light blocking property, the image pickup unit containing room being filled with the filler, the filler forming the external shape of a distal end portion with the distal end frame.
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公开(公告)号：US12070191B2
公开(公告)日：2024-08-27
申请号：US17380291
申请日：2021-07-20
Applicant: OLYMPUS CORPORATION
Inventor： Shigeru Hosokai , Hiroyuki Motohara
CPC classification number: A61B1/051 , A61B1/00018 , A61B1/00147 , A61B1/00009
Abstract: A holding frame for an imaging unit arranged at a distal end of an endoscope includes a cylindrical three-dimensional molded interconnect device; a housing configured to house the imaging unit, the housing being formed of a notch; at least one cut face formed on the side face of the holding frame and obtained by cutting a support portion which is a gate portion into which a resin is injected when the holding frame is resin-molded; a connection terminal formed on a bottom face of the housing portion and configured to be connected to the imaging unit; a cable connection electrode arranged on a face where a proximal end side of the holding frame is notched; and a wiring pattern formed on a surface area of the holding frame excluding the cut face and configured to electrically connect the connection terminal and the cable connection electrode.
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公开(公告)号：US11857166B2
公开(公告)日：2024-01-02
申请号：US17028336
申请日：2020-09-22
Applicant: OLYMPUS CORPORATION
Inventor： Hiroyuki Motohara
CPC classification number: A61B1/051 , H05K1/115 , H05K1/147 , H05K2201/10015 , H05K2201/10151 , H05K2201/10757
Abstract: An imaging unit includes: a semiconductor package including an optical system, an imaging sensor, and connection terminals; a rigid substrate including first connection lands respectively connected to the connection terminals; and an electronic component mount region including second connection lands on which a capacitor is mounted, and an inner lead mount region including third connection lands; and a flexible printed board including inner leads extended from one end of the flexible printed board in a bent manner and respectively connected to the third connection leads in the inner lead mount region; and cable connection leads arranged on another end of the flexible printed board and respectively connected to the inner leads. The rigid substrate and the flexible printed board are arranged in a projection plane in an optical axis direction of the semiconductor package. The third connection lands are arranged along one side of the rigid substrate.
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