公开(公告)号：US20230365842A1

公开(公告)日：2023-11-16

申请号：US18043226

申请日：2021-08-26

Applicant: OSAKA SODA CO., LTD.

Inventor： Masatoshi OKUDA ,  Takamichi MORI ,  Ryo KATOU ,  Junichirou MINAMI

IPC: C09J9/02 ,  C09J163/00 ,  C09J5/06

CPC classification number: C09J9/02 ,  C09J163/00 ,  C09J5/06 ,  C08K2003/0806

Abstract: Provided is an electroconductive adhesive with which, when made into an electroconductive adhesive and sintered suitably at low temperature even without pressurization during sintering of the electroconductive adhesive, a sintered body having high denseness and mechanical strength (shear strength) is formed. An electroconductive adhesive containing silver particles A having an average particle size of less than 40 nm, silver particles B having an average particle size in the range of 40 nm to less than 500 nm, silver particles C having an average particle size in the range of 0.5 to less than 5.5 μm, and a solvent, wherein the mass ratio of silver particles A:silver particles B:silver particles C is 1-20:30-60:40-70.

公开(公告)号：US20230303895A1

公开(公告)日：2023-09-28

申请号：US18040624

申请日：2021-09-03

Applicant: OSAKA SODA CO., LTD.

Inventor： Ryo KATOU ,  Masatoshi OKUDA ,  Junichirou MINAMI ,  Takamichi MORI

IPC: C09J9/02 ,  C09J11/04 ,  C08K3/08

CPC classification number: C09J9/02 ,  C09J11/04 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2201/011

Abstract: The present invention provides an electroconductive adhesive which is desirably sintered at low temperatures even without pressurization during the sintering of the electroconductive adhesive, and which forms a sintered body that has high denseness and high mechanical strength (shear strength) if used as an electroconductive adhesive. An electroconductive adhesive which contains a solvent and silver particles that have an average particle diameter within the range of from 20 nm (inclusive) to 500 nm (exclusive), wherein the moisture content in the electroconductive adhesive is 1,300 ppm or less.