Abstract:
The invention relates to a radiation-emitting device (600), which comprises a substrate (100), an inner optoelectronic component (300) and an outer optoelectronic component (200) which at least partially laterally surrounds the inner optoelectronic component (300). Further, the radiation-emitting device (600) has a cover element (500) which is arranged on the optoelectronic components (200, 300) and comprises a first contact element (521), connected to a first electrode surface of the inner optoelectronic component (300) in an electrically conductive manner, and a second contact element (522) connected to a second electrode surface of the inner optoelectronic component (300) in an electrically conductive manner.
Abstract:
An organic light-emitting component includes an organic light-emitting diode which has at least one organic layer arranged to generate light and a printed circuit board with electrical conductor tracks. The printed circuit board is an integral component of the organic light-emitting diode. At least one of the electrical conductor tracks of the printed circuit board is connected in electrically conductive manner to the organic layer of the organic light-emitting diode. The printed circuit board is electrically contactable from the side remote from the organic light-emitting diode.
Abstract:
The organic light-emitting diode (1) has a first electrode (21) with a first electric conductivity and a second electrode (22) with a second lower electric conductivity. An organic layer stack (4) for generating light is located between the electrodes (21, 22). The light-emitting diode (1) further comprises a current distribution layer (3) with a third high electric conductivity. When seen in a plan view, multiple contact regions (33) are located outside of an outer contour line (40) of the layer stack (4). The second electrode (22) and the current distribution layer (3) contact each other in the contact regions (33). In a current blocking region (34), the current distribution layer (3) is located entirely within the contour line (40) such that the second electrode (22) is electrically disconnected from the current distribution layer (3). The luminous intensity of a lighting surface (11) of the light-emitting diode (1) is preferably set in a controlled manner via the distribution of the contact regions (33) and the current blocking regions (34).
Abstract:
An organic light-emitting diode is disclosed. In an embodiment, the diode includes a first light-emitting segment and at least a second light-emitting segment, wherein the first and second light-emitting segments include a common first electrode and a common second electrode, and are configured to emit radiation with different brightnesses, wherein the first electrode includes at least one separating line that does not completely cut through the first electrode, wherein an electric conductivity of the first electrode is reduced in a region of the separating line, wherein the separating line separates the first light-emitting segment from the second light-emitting segment, and wherein the second light-emitting segment has a lower brightness during operation than the first light-emitting segment.
Abstract:
An element (1) is provided for stabilising an optoelectronic device (7), wherein the element (1) comprises a main body (1C), wherein the main body (1C) consists of a glass or at least comprises a glass and wherein the main body (1C) comprises a first and a second surface (1A, 1B). The first and second surface (1A, 1B) are opposite to one another and extend in each case in a lateral main direction of extension of the element (1), wherein a protective layer (2A, 2B) is formed at least at one of the surfaces (1A, 1B) and wherein the protective layer (2A, 2B) is configured and arranged in such a way that cracks (3) present in the main body (1C) are filled in by a material of the protective layer (2A, 2B). In addition, an optoelectronic device (7) is provided.
Abstract:
Various embodiments may relate to an optoelectronic component apparatus, including a carrier, an optoelectronic component and a thermoelectric component on or above the carrier. The optoelectronic component has a planar, optically active region. The thermoelectric component has at least one thermoelectrically sensitive section, wherein the thermoelectrically sensitive section has a first electrical conductivity at a first temperature and a second electrical conductivity at a second temperature, and wherein the thermoelectrically sensitive section is thermally connected to the optoelectronic component in a planar fashion. The thermoelectric component is formed as a temperature sensor and/or thermogenerator.
Abstract:
Various embodiments may relate to a method for producing a passive electronic component, including forming a first electrically conductive layer on a substrate, forming a second electrically conductive layer on the first electrically conductive layer, forming a first trench in the first and second electrically conductive layers such that the substrate is exposed in the first trench, wherein the first trench separates a first contact region from a second contact region, applying a dielectric in a structured fashion to the second electrically conductive layer in the first contact region and at least partly to the substrate in the first trench such that the dielectric electrically insulates the first contact region from the second contact region, and applying an electrically conductive electrode layer in a structured fashion to the dielectric above the first contact region and to the second contact region.
Abstract:
A method for producing an optoelectronic assembly having a first and at least a second optoelectronic components may include forming a first electrically conductive layer on a substrate, forming a second electrically conductive layer on the first electrically conductive layer, applying an insulator material on the second electrically conductive layer and the substrate, such that at least a first insulator region, which insulates a first component region from a second component region, a second insulator region, which insulates the second component region from a first contact region, a third insulator region arranged on a side of the first component region, and a fourth insulator region arranged between the first and second insulator regions on a side of the second component region are formed by the insulator material, forming a first and second optically functional layers in the first and second component regions, respectively, and applying an electrically conductive electrode layer.
Abstract:
A radiation-emitting apparatus includes a substrate and a number of optoelectronic components arranged on the substrate in rows running parallel to a preferred direction. Each optoelectronic component includes a sequence of layers suitable for generating electromagnetic radiation. The radiation-emitting apparatus also includes a cover element which is arranged on the plurality of optoelectronic components and which comprises a number of first contact elements, each of which is electrically connected to the first electrode faces of at least some of the optoelectronic components and a number of second contact elements, each of which is electrically connected to the second electrode faces of at least some of the optoelectronic components. The contact elements are in the form of strips and extend in the preferred direction.
Abstract:
An optoelectronic device is provided which comprises a functional layer stack (6), an encapsulation layer (7) provided for encapsulating the layer stack, and at least one metal layer (8), wherein the functional layer stack comprises at least one organic active layer (63), which emits electromagnetic radiation when the device is in operation, the encapsulation layer completely covers the at least one organic active layer when viewed in plan view onto the layer stack, and the metal layer is arranged on a side of the encapsulation layer remote from the layer stack.