公开(公告)号：US10910789B2

公开(公告)日：2021-02-02

申请号：US16471731

申请日：2018-03-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Bernhard Stich ,  Andreas Wojcik

IPC: H05K7/00 ,  H01S5/02208 ,  H01S5/022 ,  H01S5/06 ,  H05K1/18

Abstract: A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.

公开(公告)号：US20190334312A1

公开(公告)日：2019-10-31

申请号：US16471731

申请日：2018-03-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Bernhard Stich ,  Andreas Wojcik

IPC: H01S5/022 ,  H05K1/18 ,  H01S5/06

Abstract: A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.