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公开(公告)号：US11355896B2
公开(公告)日：2022-06-07
申请号：US16488573
申请日：2018-02-27
发明人： Andreas Wojcik , Markus Pindl
摘要： An optoelectronic component comprising a laser diode is disclosed. In an embodiment an optoelectronic component includes a carrier, a laser diode arranged on the carrier, wherein the laser diode is configured to emit electromagnetic radiation in a lateral radiation and a radiation-guiding layer arrangement located in front of the lateral face of the laser diode, wherein the layer arrangement includes at least a first layer and a second layer, wherein the first layer is arranged on the carrier, wherein the second layer is arranged on the first layer, wherein the first layer and the second layer abut each other, wherein the second layer is transparent for the electromagnetic radiation, wherein the first layer has a smaller refractive index than the second layer, and wherein the layer arrangement is arranged such that the electromagnetic radiation of the laser diode is coupled into the second layer, guided in the second layer to a radiation surface of the second layer, and emitted via the radiation surface of the second layer.
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公开(公告)号：US20150349222A1
公开(公告)日：2015-12-03
申请号：US14653835
申请日：2013-12-16
CPC分类号： H01L33/62 , H01L23/49548 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L51/5203 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2924/00014
摘要： An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.
摘要翻译： 光电子半导体元件包括具有两个引线框架部件的引线框架和光电子半导体芯片。 半导体芯片安装在第一引线框架部件上。 半导体部件的透光性灌封体将引线框架部件彼此机械连接。 灌封体设置用于波束整形。 第一引线框架部分具有反射槽，底座表面安装有半导体芯片。 反射槽具有三个横截面。 当在基面的平面图中看到时，这些部分围绕基部表面旋转并且在远离基部表面的方向上彼此相依。 在最接近基面的第一部分中，侧面垂直于基面定向。
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公开(公告)号：US11070025B2
公开(公告)日：2021-07-20
申请号：US16491184
申请日：2018-03-20
发明人： Andreas Wojcik , Hubert Halbritter , Josip Maric
IPC分类号： H01S3/00 , H01S5/026 , H01S5/042 , H01S5/068 , H01S5/02345 , H01S5/0236 , H01S5/062 , H01S5/0237
摘要： A semiconductor radiation source includes at least one semiconductor chip that generates radiation; a controller with one or more switching elements configured for pulsed operation of the semiconductor chip; and at least one capacitor body, wherein the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the controller electrically connects to a side of the semiconductor chip opposite the capacitor body, and the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the capacitor body is located between the control unit and the semiconductor chip.
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公开(公告)号：US10910789B2
公开(公告)日：2021-02-02
申请号：US16471731
申请日：2018-03-12
发明人： Markus Pindl , Bernhard Stich , Andreas Wojcik
IPC分类号： H05K7/00 , H01S5/02208 , H01S5/022 , H01S5/06 , H05K1/18
摘要： A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.
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公开(公告)号：US20180053801A1
公开(公告)日：2018-02-22
申请号：US15557589
申请日：2016-03-17
发明人： Karsten Auen , Andreas Wojcik , Hubert Halbritter , Tim Böscke
IPC分类号： H01L27/146 , G01S17/89
CPC分类号： H01L27/14627 , G01S17/89 , H01L27/14605 , H01L27/14625 , H01L27/14629 , H01L27/14634 , H01L27/14636
摘要： A sensor device is disclosed. In an embodiment, the sensor device includes a carrier having a plane carrier surface, a plurality of photodetectors arranged on the carrier surface, each photodetector including a photosensitive sensor area and a lens arrangement arranged opposite the sensor areas, wherein the lens arrangement includes an optical axis, wherein the lens arrangement is configured to image electromagnetic radiation onto the sensor areas, wherein the plurality of photodetectors comprise at least one first photodetector having a first sensor area, the first sensor area comprises at least one property which differs from a property of a second sensor area of a second photodetector of the plurality of photodetectors, and wherein the second photodetector is arranged closer to the optical axis than the at least one first photodetector in order to reduce an optical imaging aberration of the lens arrangement.
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公开(公告)号：US11355897B2
公开(公告)日：2022-06-07
申请号：US16092422
申请日：2017-04-12
IPC分类号： H01S5/02255 , H01S5/0231 , H01S5/02234
摘要： In an embodiment a light-emitting component includes a housing and an edge emitting semiconductor laser arranged in the housing, wherein the semiconductor laser is configured to emit light at a side face in an angle range, wherein the housing includes an emission opening for emitting the light, wherein the semiconductor laser is arranged in a first layer having a first material, wherein a second layer is arranged on the first layer, the second layer having a second material, wherein the first layer and the second layer are transmissive to the light, wherein the second layer is arranged between the first layer and the emission opening, wherein the emission opening lies at least partly outside the angle range of the semiconductor laser, and wherein a part of the light is directed directly onto an interface between the first and second layers.
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公开(公告)号：US10511138B2
公开(公告)日：2019-12-17
申请号：US15754333
申请日：2016-08-23
发明人： Andreas Wojcik , Martin Haushalter
摘要： A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.
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公开(公告)号：US20190334312A1
公开(公告)日：2019-10-31
申请号：US16471731
申请日：2018-03-12
发明人： Markus Pindl , Bernhard Stich , Andreas Wojcik
摘要： A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.
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公开(公告)号：US20140307755A1
公开(公告)日：2014-10-16
申请号：US14352677
申请日：2012-09-27
发明人： Andreas Wojcik , Josip Maric , Martin Haushalter , Frank Möllmer
IPC分类号： H01S5/022
CPC分类号： H01S5/02236 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02296 , H01S5/0428 , H01L2924/00
摘要： A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least. in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.
摘要翻译： 具有金属载体主体（1）的辐射发射部件包括至少两个用于与部件电接触的连接位置（1a，1b），激光二极管芯片（2），固定到 金属载体主体（1），并且与至少两个连接位置（1a，1b）导电连接，壳体（3）在其中围绕金属载体主体（1）的位置形成，其中壳体（3）形成 使用塑料，连接位置（1a，1b）至少在每种情况下延伸。 在沿壳体（3）的底面（3a）和侧面（3b）的位置处，所述侧面相对于底面横向延伸，并且该部件通过连接位置（1a）可表面安装 ，1b），使得底面（3a）或侧面（3b）形成部件的安装面。
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公开(公告)号：US20190312407A1
公开(公告)日：2019-10-10
申请号：US16302569
申请日：2017-05-16
发明人： Hubert Halbritter , Andreas Wojcik
摘要： The invention relates to an assembly comprising an electric component. The component has an electric part, a control circuit, and a capacitor. At least two lead frames are provided which are embedded into a housing. The part, the control circuit, and the capacitor are arranged on the lead frames, and the control circuit is designed to charge the capacitor and to supply the part with current from the capacitor in a clocked manner. The component has two contacts, and the component is arranged on a support. The support has an electrically conductive layer and the two contacts are connected to the layer in an electrically conductive manner. At least one first part of one lead frame is arranged at a greater distance from the electrically conductive layer than the second lead frame.
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