公开(公告)号：US09627304B2

公开(公告)日：2017-04-18

申请号：US15029693

申请日：2013-10-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Choo Kean Lim ,  Chee Jia Chang ,  Choon Keat Or

IPC: H01L33/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L33/48 ,  H01L23/488

CPC classification number: H01L23/49805 ,  H01L21/4846 ,  H01L21/4853 ,  H01L23/488 ,  H01L24/05 ,  H01L24/94 ,  H01L24/95 ,  H01L33/486 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00

Abstract: A method of producing a multiplicity of surface-mountable carrier devices includes: A) providing a carrier plate having a first main face and a second main face located opposite the first main face, B) applying an electrically conductive layer to the first main face, C) applying a solder resist mask to a side of the electrically conductive layer remote from the carrier plate, wherein a multiplicity of adjoining regions are formed on the electrically conductive layer by the solder resist mask, D) applying a solder material to the solder resist mask and the electrically conductive layer, wherein the solder resist mask and the electrically conductive layer are at least partially covered by the solder material, and E) singulating the carrier plate and the electrically conductive layer along and through the solder resist mask and the solder material, wherein the solder material remains at least partially on the solder resist mask.

公开(公告)号：US20160268186A1

公开(公告)日：2016-09-15

申请号：US15029693

申请日：2013-10-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Choo Kean Lim ,  Chee Jia Chang ,  Choon Keat Or

IPC: H01L23/498 ,  H01L33/48 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49805 ,  H01L21/4846 ,  H01L21/4853 ,  H01L23/488 ,  H01L24/05 ,  H01L24/94 ,  H01L24/95 ,  H01L33/486 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00

Abstract: A method of producing a multiplicity of surface-mountable carrier devices includes: A) providing a carrier plate having a first main face and a second main face located opposite the first main face, B) applying an electrically conductive layer to the first main face, C) applying a solder resist mask to a side of the electrically conductive layer remote from the carrier plate, wherein a multiplicity of adjoining regions are formed on the electrically conductive layer by the solder resist mask, D) applying a solder material to the solder resist mask and the electrically conductive layer, wherein the solder resist mask and the electrically conductive layer are at least partially covered by the solder material, and E) singulating the carrier plate and the electrically conductive layer along and through the solder resist mask and the solder material, wherein the solder material remains at least partially on the solder resist mask.

Abstract translation: 一种制造多个可表面安装的载体装置的方法包括：A）提供具有第一主面和与第一主面相对的第二主面的承载板，B）向第一主面施加导电层， C）将阻焊掩模施加到远离载体板的导电层的一侧，其中通过阻焊掩模在导电层上形成多个相邻的区域，D）将焊料材料施加到阻焊层 掩模和所述导电层，其中所述阻焊掩模和所述导电层至少部分地被所述焊料材料覆盖，以及E）沿着所述阻焊掩模和所述焊料材料沿着所述阻焊掩模和所述焊料材料分割所述载体板和所述导电层 其中焊料材料至少部分保留在阻焊掩模上。