公开(公告)号：US20200235269A1

公开(公告)日：2020-07-23

申请号：US16647782

申请日：2018-04-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mohd Fauzi Zainordin ,  Khairul Mohd Arshad ,  Sok Gek Beh ,  Jun Jun Lim

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

Abstract: An optoelectronic component is disclosed. In an embodiment an optoelectronic component includes a housing body, an optical element and a rabbet comprising a shoulder and a cheek, wherein the rabbet is located on an upper side of the housing body, wherein the optical element is located in the rabbet such that a brim of the optical element rests on the shoulder of the rabbet, wherein the upper side of the housing body comprises a rectangular shape, and wherein the shoulder of the rabbet is located only at corners of the rabbet.

公开(公告)号：US11616176B2

公开(公告)日：2023-03-28

申请号：US16647782

申请日：2018-04-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mohd Fauzi Zainordin ,  Khairul Mohd Arshad ,  Sok Gek Beh ,  Jun Jun Lim

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

Abstract: An optoelectronic component is disclosed. In an embodiment an optoelectronic component includes a housing body, an optical element and a rabbet comprising a shoulder and a cheek, wherein the rabbet is located on an upper side of the housing body, wherein the optical element is located in the rabbet such that a brim of the optical element rests on the shoulder of the rabbet, wherein the upper side of the housing body comprises a rectangular shape, and wherein the shoulder of the rabbet is located only at corners of the rabbet.

公开(公告)号：US20210050493A1

公开(公告)日：2021-02-18

申请号：US16979677

申请日：2018-03-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jun Jun Lim ,  Sok Gek Beh ,  Mohd Fauzi Zainordin ,  Purusothaman Supramaniam

IPC: H01L33/58 ,  H01L33/48 ,  H01S5/022 ,  H01S5/02

Abstract: An optoelectronic semiconductor device and a method for producing an optoelectronic semiconductor device are disclosed. In an embodiment an optoelectronic semiconductor device includes a carrier having at least two electrically conductive components connected by an electrically insulating material, an optoelectronic semiconductor chip fixed to the carrier at a top side of the carrier, the optoelectronic semiconductor chip configured to emit electromagnetic radiation, a total internal reflection lens and a housing surrounding the total internal reflection lens laterally, wherein the electrically insulating material does not protrude over the electrically conductive components at the top side of the carrier, wherein the housing and the total internal reflection lens are arranged at a radiation exit side of the optoelectronic semiconductor chip, and wherein the total internal reflection lens does not protrude over the housing at an upper side of the optoelectronic semiconductor device, the upper side facing away from the carrier.