公开(公告)号：US20180226555A1

公开(公告)日：2018-08-09

申请号：US15750316

申请日：2015-08-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kok Eng Ng ,  Wui Chai Chew ,  Choo Kean Lim ,  Mardiana Khalid

IPC: H01L33/64 ,  H01L33/62 ,  H01L23/498 ,  H01L25/075 ,  H01L21/48 ,  H01L23/00 ,  H01L23/373 ,  H01L23/538

Abstract: An electronic device includes a carrier and a semiconductor chip, wherein the carrier includes a first dielectric layer and a second dielectric layer, a thermal conductivity of the first dielectric layer exceeds a thermal conductivity of the second dielectric layer, the second dielectric layer is arranged on the first dielectric layer and partially covers the first dielectric layer, the semiconductor chip is arranged on the carrier in a mounting area in which the first dielectric layer is not covered by the second dielectric layer, and the carrier includes a solder terminal for electrical contacting arranged on the second dielectric layer.

公开(公告)号：US10483446B2

公开(公告)日：2019-11-19

申请号：US15750316

申请日：2015-08-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kok Eng Ng ,  Wui Chai Chew ,  Choo Kean Lim ,  Mardiana Khalid

IPC: H01L21/48 ,  H01L33/64 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50

Abstract: An electronic device includes a carrier and a semiconductor chip, wherein the carrier includes a first dielectric layer and a second dielectric layer, a thermal conductivity of the first dielectric layer exceeds a thermal conductivity of the second dielectric layer, the second dielectric layer is arranged on the first dielectric layer and partially covers the first dielectric layer, the semiconductor chip is arranged on the carrier in a mounting area in which the first dielectric layer is not covered by the second dielectric layer, and the carrier includes a solder terminal for electrical contacting arranged on the second dielectric layer.

公开(公告)号：US10072833B2

公开(公告)日：2018-09-11

申请号：US14911765

申请日：2013-08-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kok Eng Ng ,  Choo Kean Lim ,  Eu Liong Ong ,  Boon Liang Yap

IPC: F21V23/00 ,  F21V29/15 ,  F21V17/10 ,  F21V29/70 ,  F21Y115/10

CPC classification number: F21V29/15 ,  F21V17/101 ,  F21V29/70 ,  F21Y2115/10

Abstract: A light apparatus includes a first carrier with an optoelectronic component for generating electromagnetic radiation, a second carrier with at least one electronic component for controlling the optoelectronic component, and a thermally insulating layer arranged between, and attached to, the first and second carriers.

公开(公告)号：US20160186976A1

公开(公告)日：2016-06-30

申请号：US14911765

申请日：2013-08-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kok Eng Ng ,  Choo Kean Lim ,  Eu Liong Ong ,  Boon Liang Yap

IPC: F21V29/15 ,  F21V29/70 ,  F21V17/10

CPC classification number: F21V29/15 ,  F21V17/101 ,  F21V29/70 ,  F21Y2115/10

Abstract: A light apparatus is disclosed. Embodiments of the light apparatus includes a first carrier with at least one electronic component for controlling an optoelectronic component, a second carrier with the optoelectronic component for generating electromagnetic radiation and a thermally insulating layer arranged between the first and second carriers, wherein the first and second carriers are attached to the insulating layer.

Abstract translation: 公开了一种灯装置。 光装置的实施例包括具有至少一个用于控制光电子部件的电子部件的第一载体，具有用于产生电磁辐射的光电子部件的第二载体和布置在第一和第二载体之间的绝热层，其中第一和第二载体 载体附着到绝缘层。