公开(公告)号：US20170263836A1

公开(公告)日：2017-09-14

申请号：US15500182

申请日：2015-07-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Eu Liong Ong ,  Bin Abdul Manaf Shahrol Izzanni ,  Boon Liang Yap ,  Mohd Fauzi Zainordin

IPC: H01L33/62 ,  H01L25/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/54

Abstract: A method of producing a device includes providing a strip-shaped leadframe, wherein the leadframe includes leadframe sections arranged in a row next to one another and connection structures connecting the leadframe sections, the connection structures each connecting two adjacent leadframe sections; forming molded bodies on the leadframe, the molded bodies each mechanically connecting two adjacent leadframe sections; arranging semiconductor chips on the leadframe; and interrupting the connections of the leadframe sections realized by the connection structures.

公开(公告)号：US12199218B2

公开(公告)日：2025-01-14

申请号：US17428721

申请日：2019-03-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ee Lian Lee ,  Boon Liang Yap ,  Prakash Rajah

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60

Abstract: In an embodiment an optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a radiation exit surface and side surfaces running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface, a conversion element arranged on the radiation exit surface, the conversion element configured to convert at least part of the primary radiation into secondary radiation and including a stack of at least two conversion layers and a reflective element laterally surrounding the optoelectronic semiconductor chip, wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface, wherein the conversion element includes a part laterally extending beyond the radiation exit surface and being concavely curved, wherein the conversion element is partly arranged on the reflective element, and wherein the conversion element is arranged on a concavely curved surface of the reflective element.

公开(公告)号：US12095013B2

公开(公告)日：2024-09-17

申请号：US17430283

申请日：2019-04-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ee Lian Lee ,  Boon Liang Yap ,  Prakash Rajah

IPC: H01L33/58 ,  H01L33/00 ,  H01L33/54

CPC classification number: H01L33/58 ,  H01L33/005 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0058

Abstract: In an embodiment a method for producing a plurality of radiation-emitting devices includes providing a plurality of semiconductor chips on a main surface of a carrier, each semiconductor chip for emitting electromagnetic radiation from a radiation exit surface, arranging a lens mold with a plurality of cavities over the carrier, introducing a liquid mold material into the cavities of the lens mold and curing the liquid mold material such that a plurality of molded lenses is generated, wherein the molded lenses directly adjoin the main surface of the carrier, wherein regions of an outer surface of the molded lenses directly adjacent to the main surface of the carrier are free of planar areas, and wherein the carrier includes a plurality of carrier elements, the carrier elements having a first recess in a main surface extending from a side face of the carrier element.

公开(公告)号：US20220077361A1

公开(公告)日：2022-03-10

申请号：US17430283

申请日：2019-04-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ee Lian Lee ,  Boon Liang Yap ,  Prakash Rajah

IPC: H01L33/58 ,  H01L33/00 ,  H01L33/54

Abstract: In an embodiment a method for producing a plurality of radiation-emitting devices includes providing a plurality of semiconductor chips on a main surface of a carrier, each semiconductor chip for emitting electromagnetic radiation from a radiation exit surface, arranging a lens mold with a plurality of cavities over the carrier, introducing a liquid mold material into the cavities of the lens mold and curing the liquid mold material such that a plurality of molded lenses is generated, wherein the molded lenses directly adjoin the main surface of the carrier, wherein regions of an outer surface of the molded lenses directly adjacent to the main surface of the carrier are free of planar areas, and wherein the carrier includes a plurality of carrier elements, the carrier elements having a first recess in a main surface extending from a side face of the carrier element.

公开(公告)号：US10072833B2

公开(公告)日：2018-09-11

申请号：US14911765

申请日：2013-08-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kok Eng Ng ,  Choo Kean Lim ,  Eu Liong Ong ,  Boon Liang Yap

IPC: F21V23/00 ,  F21V29/15 ,  F21V17/10 ,  F21V29/70 ,  F21Y115/10

CPC classification number: F21V29/15 ,  F21V17/101 ,  F21V29/70 ,  F21Y2115/10

Abstract: A light apparatus includes a first carrier with an optoelectronic component for generating electromagnetic radiation, a second carrier with at least one electronic component for controlling the optoelectronic component, and a thermally insulating layer arranged between, and attached to, the first and second carriers.

公开(公告)号：US20160186976A1

公开(公告)日：2016-06-30

申请号：US14911765

申请日：2013-08-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kok Eng Ng ,  Choo Kean Lim ,  Eu Liong Ong ,  Boon Liang Yap

IPC: F21V29/15 ,  F21V29/70 ,  F21V17/10

CPC classification number: F21V29/15 ,  F21V17/101 ,  F21V29/70 ,  F21Y2115/10

Abstract: A light apparatus is disclosed. Embodiments of the light apparatus includes a first carrier with at least one electronic component for controlling an optoelectronic component, a second carrier with the optoelectronic component for generating electromagnetic radiation and a thermally insulating layer arranged between the first and second carriers, wherein the first and second carriers are attached to the insulating layer.

Abstract translation: 公开了一种灯装置。 光装置的实施例包括具有至少一个用于控制光电子部件的电子部件的第一载体，具有用于产生电磁辐射的光电子部件的第二载体和布置在第一和第二载体之间的绝热层，其中第一和第二载体 载体附着到绝缘层。