公开(公告)号：US20180013043A1

公开(公告)日：2018-01-11

申请号：US15544288

申请日：2016-01-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Korbinian Perlmaier ,  Anna Kasprzak-Zablocka ,  Stefanie Rammelsberger ,  Julian Ikonomov

IPC: H01L33/62 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L31/02005 ,  H01L31/0203 ,  H01L33/40 ,  H01L33/486 ,  H01L2933/0066

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip; and an electrical connection point that contacts the optoelectronic semiconductor chip, wherein the electrical connection point covers the optoelectronic semiconductor chip on the bottom thereof at least in some areas, the electrical connection point includes a contact layer facing toward the optoelectronic semiconductor chip, the electrical connection point includes at least one barrier layer arranged on a side of the contact layer facing away from the optoelectronic semiconductor chip, the electrical connection point includes a protective layer arranged on the side of the at least one barrier layer facing away from the contact layer, the layers of the electrical connection point are arranged one on top of another along a stack direction, and the stack direction runs perpendicular to a main extension plane of the optoelectronic semiconductor chip.