公开(公告)号：US12266744B2

公开(公告)日：2025-04-01

申请号：US17284825

申请日：2018-10-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mei See Boon ,  Hui Chiang Teoh ,  Tomin Liu ,  Hui Ying Pee ,  Asliza Alias ,  Lay Teng Tan ,  Yuan Liang ,  Alex Kheng Hooi Lim ,  Wing Yew Wong

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/62

Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

公开(公告)号：US20210359174A1

公开(公告)日：2021-11-18

申请号：US17284825

申请日：2018-10-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mei See Boon ,  Hui Chiang Teoh ,  Tomin Liu ,  Hui Ying Pee ,  Asliza Alias ,  Lay Teng Tan ,  Yuan Liang ,  Alex Kheng Hooi Lim ,  Wing Yew Wong

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/62

Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.