公开(公告)号：US20210359174A1

公开(公告)日：2021-11-18

申请号：US17284825

申请日：2018-10-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mei See Boon ,  Hui Chiang Teoh ,  Tomin Liu ,  Hui Ying Pee ,  Asliza Alias ,  Lay Teng Tan ,  Yuan Liang ,  Alex Kheng Hooi Lim ,  Wing Yew Wong

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/62

Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

公开(公告)号：US12266744B2

公开(公告)日：2025-04-01

申请号：US17284825

申请日：2018-10-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mei See Boon ,  Hui Chiang Teoh ,  Tomin Liu ,  Hui Ying Pee ,  Asliza Alias ,  Lay Teng Tan ,  Yuan Liang ,  Alex Kheng Hooi Lim ,  Wing Yew Wong

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/62

Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

公开(公告)号：US10109562B2

公开(公告)日：2018-10-23

申请号：US15547703

申请日：2015-02-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sok Gek Beh ,  Mei See Boon ,  Wing Yew Wong ,  Hui Ying Pee

IPC: H01L23/495 ,  H01L21/00

Abstract: A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.

公开(公告)号：US20180033932A1

公开(公告)日：2018-02-01

申请号：US15547703

申请日：2015-02-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sok Gek Beh ,  Mei See Boon ,  Wing Yew Wong ,  Hui Ying Pee

IPC: H01L33/62 ,  H01L23/495

CPC classification number: H01L23/49548 ,  H01L23/4951 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.