公开(公告)号：US12266744B2

公开(公告)日：2025-04-01

申请号：US17284825

申请日：2018-10-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mei See Boon ,  Hui Chiang Teoh ,  Tomin Liu ,  Hui Ying Pee ,  Asliza Alias ,  Lay Teng Tan ,  Yuan Liang ,  Alex Kheng Hooi Lim ,  Wing Yew Wong

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/62

Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

公开(公告)号：US20210359174A1

公开(公告)日：2021-11-18

申请号：US17284825

申请日：2018-10-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mei See Boon ,  Hui Chiang Teoh ,  Tomin Liu ,  Hui Ying Pee ,  Asliza Alias ,  Lay Teng Tan ,  Yuan Liang ,  Alex Kheng Hooi Lim ,  Wing Yew Wong

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/62

Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

公开(公告)号：US20220059741A1

公开(公告)日：2022-02-24

申请号：US17421468

申请日：2019-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander Baumgartner ,  T'ing Qi'ao Leow ,  Tomin Liu ,  Kathy Schmidtke

IPC: H01L33/58 ,  H01L33/56 ,  H01S5/02234

Abstract: In an embodiment a radiation emitting device includes a semiconductor chip configured to emit electromagnetic radiation of a first wavelength range from a radiation exit surface and a potting comprising a matrix material and a plurality of nanoparticles, wherein a concentration of the nanoparticles in the matrix material decreases starting from the radiation exit surface of the semiconductor chip so that a refractive index of the potting decreases starting from the radiation exit surface of the semiconductor chip, and wherein the nanoparticles are coated with a shell.

公开(公告)号：US12211964B2

公开(公告)日：2025-01-28

申请号：US17421468

申请日：2019-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander Baumgartner ,  T'ing Qi'ao Leow ,  Tomin Liu ,  Kathy Schmidtke

IPC: H01L33/58 ,  H01L33/56 ,  H01S5/02234 ,  H01L33/50

Abstract: In an embodiment a radiation emitting device includes a semiconductor chip configured to emit electromagnetic radiation of a first wavelength range from a radiation exit surface and a potting comprising a matrix material and a plurality of nanoparticles, wherein a concentration of the nanoparticles in the matrix material decreases starting from the radiation exit surface of the semiconductor chip so that a refractive index of the potting decreases starting from the radiation exit surface of the semiconductor chip, and wherein the nanoparticles are coated with a shell.

公开(公告)号：US12113156B2

公开(公告)日：2024-10-08

申请号：US17609801

申请日：2019-05-09

Applicant: Osram Opto Semiconductors GmbH

Inventor： Tomin Liu ,  T'ing Qi'ao Leow ,  Keng Chong Lim

IPC: H01L33/50 ,  C09K11/77 ,  G02B5/20 ,  B82Y30/00

CPC classification number: H01L33/504 ,  C09K11/7705 ,  C09K11/77068 ,  G02B5/208 ,  B82Y30/00

Abstract: A radiation-emitting device may include a radiation-emitting semiconductor chip configured to emit electromagnetic radiation of a first wavelength range from a radiation exit surface, a first phosphor configured to convert electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range. The second wavelength range may be or include infrared light. The device may further include an up-converting phosphor configured to convert infrared light of the second wavelength range into visible light.