公开(公告)号：US20170288091A1

公开(公告)日：2017-10-05

申请号：US15514489

申请日：2015-09-24

Applicant: OSRAM Opto Semiconductors GmbH ,  OSRAM GmbH

Inventor： Bernd BOEHM ,  Daniel ZASPEL ,  Stefan HARTAUER ,  Bjoern HOXHOLD

IPC: H01L33/00

CPC classification number: H01L33/0095 ,  H01L33/486 ,  H01L33/642 ,  H01L2933/005

Abstract: The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (10), comprising the following steps: •A) arranging at least one semiconductor chip (2) on a carrier (1), •B) applying an electrically insulating photoresist (3) to a top side (1a) of the carrier (1) and to the semiconductor chip (2), •C) curing the photoresist (3) with a baking step, •D) patterning the photoresist (3) by exposure, •F) developing the photoresist (3), wherein the photoresist (3) is removed at least from a radiation penetration surface (2b) of the semiconductor chip (2), •G) again curing the photoresist (3) with a baking step, and •H) applying an electrically conductive contact layer (4) to the photoresist (3), wherein the electrically conductive contact layer (4) is in places at a distance (A) from a marginal surface (3a) of the photoresist (3) which faces towards the semiconductor chip (2), wherein the marginal surface (3a) facing towards the semiconductor chip (2) is exposed in places.