-
公开(公告)号：US3813295A
公开(公告)日：1974-05-28
申请号：US25144772
申请日：1972-05-08
申请人： OWENS ILLINOIS INC
IPC分类号： C03C3/072 , C03C4/16 , C03C8/12 , C03C8/14 , C04B35/48 , H01B3/08 , H01G4/12 , H05K1/03 , H05K3/46 , C04B35/00 , H01B1/06 , H01B3/02
CPC分类号： C03C8/14 , C03C3/072 , C03C4/16 , C03C8/12 , C04B35/481 , H01B3/087 , H01G4/129 , H05K1/0306 , H05K3/4685 , Y10T428/24909 , Y10T428/256
摘要： A DIELECTRIC MATERIAL IS FORMULATED BY FIRING AN ADMIXTURE OF FROM ABOUT 2-55% BY WEIGHT ZIRCON (ZIRCONIUM SILICATE) AND ABOUT 45-98% BY WEIGHT OF A LEAD BARIUM BOROSILICATE GLASS. IN FINAL FORM, THE DIELECTRIC MATERIAL EXHIBITS A LOWER (APPROXIMATELY 6) AND A HIGH Q VALUE. THE PASTE COMPOSITION OF FORMULATED BY ADMIXING THE AFROEMENTIONED INGREDIENTS IN AN ORGANIC VEHICLE, DRYING THE PASTE AND FIRING THE PASTE AT A TEMPERATURE OF FROM ABOUT 800-1,000* C. THE PASTE IS USUALLY APPLIED VY A SCREEN PRINTING TECHNIQUE PREFERABLY USING A MESH SIZE IN THE RANGE OF ABOUT 165.
-
公开(公告)号：US3846345A
公开(公告)日：1974-11-05
申请号：US27674372
申请日：1972-07-31
申请人： OWENS ILLINOIS INC
CPC分类号： H05K1/092 , B22F1/025 , H01B1/16 , H01C17/065 , H01C17/06526 , H01L49/02 , Y10T428/12181 , Y10T428/252 , Y10T428/256
摘要： A resistor and conductor paste compositions and structures formed therefrom for hybrid integrated circuits are disclosed in which a metal which substantially contributes the electrical conductivity is coated over micron-sized glass particles the metal coated particles are then mixed and fused into a glass matrix the whole adhering to a ceramic substrate. This structure results in greater conductivity for a given quantity of the metal. Efficient metals for the purpose are silver and the noble metals and alloys of these relatively expensive materials.
摘要翻译： 公开了一种用于混合集成电路的电阻和导体糊料组合物及其结构，其中基本上有助于导电性的金属涂覆在微米级玻璃颗粒上，然后将金属涂覆的颗粒混合并熔合成玻璃基质，整体粘附 到陶瓷基板。 对于给定量的金属，该结构导致更大的导电性。
-
公开(公告)号：US3778285A
公开(公告)日：1973-12-11
申请号：US3778285D
申请日：1972-01-27
申请人： OWENS ILLINOIS INC
发明人： MASON D
IPC分类号： C03C3/074 , C03C8/10 , C03C8/12 , C03C8/14 , C03C8/20 , H01B3/08 , H01G4/12 , C08B27/42 , C08B27/04
摘要： UNIQUE DIELECTRIC COMPOSITIONS MAY BE USED TO FORMULATE THICK FILM PASTES FOR PRINTING MICROELECTRONIC CAPACITORS. THE RESLUTING DIELECTRICS EXHIBIT DIELECTRIC CONSTANTS GREATER THAN ABOUT 500 AND CAPACITANCES GREATER THAN ABOUT 80,000 PICONFARADS PER SQUARE INCH AT A THICKNESS OF AT LEAST ABOUT 1.0 MIL. THE UNIQUE DIELECTRIC COMPOSITIONS COMPRISE ABOUT 55-76 PERCENT BY WEIGHT OF A FERROLECTRIC MATERIAL AND 45-24 PERCENT OF A GLASS BINDER. THE GLASS BINDER EMPLOYED COMPRISES A LEAD BARIUM BOROSILICATE GLASS AND A FERROELECTRIC MATERIAL PREVIOUSLY DISSOLVED THEREIN. THE COMPOSITION IS FORMULTED INTO A PRINTING PASTE BY FIRST DISSOLVING 20-30 PERCENT BY WEIGHT FERROELECTRIC INTO 70-80 PERCENT BY WEIGHT LEAD BARIUM BOROSILICATE GLASS BINDER, COOLING THE NEWLY FORMED GLASS TO A SOLID STATE, COMMINUTING THE GLASS TO A PARTICLE SIZE OF LESS THAN ABOUT 1 MICRON AND THEREAFTER ADMIXING THE COMMINUTED GLASS WITH THE SAME PARTICULTE FERROELECTRIC IN AN AMOUNT AS INDICATED. THIS ADMIXTURE IS THEN ADDED TO A LIQUID ORGANIC CARRIER VEHICLE TO FORMULATE THE PRINTING PASTE. THE RPINTING PASTE IS THEN PRINTED INTO A CHOSEN DESING AND FIRED AT A TEMPERATURE OF APPROXIMATELY 1,000-1,050*C. TO PRODUCE A HIGHLY DENSE, UNIFORM, AND SUBSTANTIALLY CRACK-FREE DIELECTRIC MATERIAL.
-
公开(公告)号：US3720862A
公开(公告)日：1973-03-13
申请号：US3720862D
申请日：1972-01-27
申请人： OWENS ILLINOIS INC
发明人： MASON D
摘要： Unique dielectric compositions may be used to formulate thick film pastes for printing microelectronic capacitors. The resulting dielectrics exhibit dielectric constants greater than about 500 and capacitances greater than about 80,000 picofarads per square inch at a thickness of at least about 1.0 mils. The unique dielectric compositions comprise about 55-76 percent by weight of a ferroelectric material and 45-24 percent of a glass binder. The glass binder employed comprises a lead barium borosilicate glass and a ferroelectric material previously dissolved therein. The composition is formulated into a printing paste by first dissolving 20-30 percent by weight ferroelectric into 70-80 percent by weight lead barium borosilicate glass binder, cooling the newly formed glass to a solid state, comminuting the glass to a particle size of less than about 1 micron and thereafter admixing the comminuted glass with the same particulate ferroelectric in an amount as indicated. This admixture is then added to a liquid organic carrier vehicle to formulate the printing paste. The printing paste is then printed into a chosen design and fired at a temperature of approximately 1,000*-1,050* C. to produce a highly dense, uniform, and substantially crack-free dielectric material.
-
公开(公告)号：US3718608A
公开(公告)日：1973-02-27
申请号：US3718608D
申请日：1969-10-06
申请人： OWENS ILLINOIS INC
CPC分类号： H01C17/06526 , B22F1/025 , H01B1/16 , H01L49/02
摘要： Resistor and conductor paste compositions and structures formed therefrom for hybrid integrated circuits are disclosed in which a metal which substantially contributes the electrical conductivity is coated over micron-sized glass particles. The metal coated particles are then mixed and fused into a glass matrix, the whole adhering to a ceramic substrate. This structure results in greater conductivity for a given quantity of the metal. Efficient metals for the purpose are silver and the noble metals and alloys of these relatively expensive materials.
摘要翻译： 公开了用于混合集成电路从其形成的电阻和导体糊料组合物和结构，其中基本上有助于导电性的金属涂覆在微米级玻璃颗粒上。 然后将金属涂覆的颗粒混合并熔合成玻璃基质，整体粘附到陶瓷基底上。 对于给定量的金属，该结构导致更大的导电性。
-
-
-
-
搜索结果
5 条记录 (耗时 0.015 秒)
