公开(公告)号：US20150228583A1

公开(公告)日：2015-08-13

申请号：US14692400

申请日：2015-04-21

申请人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

发明人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

IPC分类号： H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/5381 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3142 ,  H01L23/485 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5226 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/37002 ,  H01L2924/00 ,  H01L2924/01033

摘要： Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

公开(公告)号：US09391025B2

公开(公告)日：2016-07-12

申请号：US14692400

申请日：2015-04-21

申请人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

发明人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L23/538 ,  H01L23/522 ,  H01L23/13 ,  H01L21/56 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L23/5381 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3142 ,  H01L23/485 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5226 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/37002 ,  H01L2924/00 ,  H01L2924/01033

摘要： Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

摘要翻译： 描述了用于电子部件的可靠的微带布线布置。 在一个示例中，半导体器件包括具有其上具有集成电路的表面的半导体管芯，其通过多个导电触点耦合到半导体封装衬底的最上层金属化层的接触焊盘。 多个离散金属平面设置在半导体封装基板的最上层的金属化层上，每个金属平面从平面图的角度位于半导体管芯的周边的角部。 从半导体封装基板的最上层的金属化层设置微带布线，从平面图的角度来看，位于半导体管芯的外围。

公开(公告)号：US20160300796A1

公开(公告)日：2016-10-13

申请号：US15183645

申请日：2016-06-15

申请人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

发明人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

IPC分类号： H01L23/538 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L23/5381 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3142 ,  H01L23/485 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5226 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/37002 ,  H01L2924/00 ,  H01L2924/01033

摘要： Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

公开(公告)号：US09041205B2

公开(公告)日：2015-05-26

申请号：US13930086

申请日：2013-06-28

申请人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

发明人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/04 ,  H01L23/538 ,  H01L23/522 ,  H01L23/485 ,  H01L23/498

CPC分类号： H01L23/5381 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3142 ,  H01L23/485 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5226 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/37002 ,  H01L2924/00 ,  H01L2924/01033

摘要： A semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

摘要翻译： 一种半导体器件包括其上具有集成电路的表面的半导体管芯，其通过多个导电触点耦合到半导体封装衬底的最上层金属化层的接触焊盘。 多个离散金属平面设置在半导体封装基板的最上层的金属化层上，每个金属平面从平面图的角度位于半导体管芯的周边的角部。 从半导体封装基板的最上层的金属化层设置微带布线，从平面图的角度来看，位于半导体管芯的外围。

公开(公告)号：US09607947B2

公开(公告)日：2017-03-28

申请号：US15183645

申请日：2016-06-15

申请人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

发明人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

IPC分类号： H01L23/49 ,  H01L23/00 ,  H01L25/00 ,  H01L23/538 ,  H01L23/522 ,  H01L23/498 ,  H01L23/13 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/485

CPC分类号： H01L23/5381 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3142 ,  H01L23/485 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5226 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/37002 ,  H01L2924/00 ,  H01L2924/01033

摘要： Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

公开(公告)号：US20150001733A1

公开(公告)日：2015-01-01

申请号：US13930086

申请日：2013-06-28

申请人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

发明人： Omkar G. Karhade ,  Nevin Altunyurt ,  Kyu Oh Lee ,  Krishna Bharath

IPC分类号： H01L23/538 ,  H01L23/522

CPC分类号： H01L23/5381 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3142 ,  H01L23/485 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5226 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00011 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/37002 ,  H01L2924/00 ,  H01L2924/01033

摘要： Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

摘要翻译： 描述了用于电子部件的可靠的微带布线布置。 在一个示例中，半导体器件包括具有其上具有集成电路的表面的半导体管芯，其通过多个导电触点耦合到半导体封装衬底的最上层金属化层的接触焊盘。 多个离散金属平面设置在半导体封装基板的最上层的金属化层上，每个金属平面从平面图的角度位于半导体管芯的周边的角部。 从半导体封装基板的最上层的金属化层设置微带布线，从平面图的角度来看，位于半导体管芯的外围。

公开(公告)号：US20140203417A1

公开(公告)日：2014-07-24

申请号：US13976447

申请日：2011-12-29

申请人： Nevin Altunyurt ,  Kemal Aygun ,  Kevin J. Doran ,  Yidnekachew S. Mekonnen

发明人： Nevin Altunyurt ,  Kemal Aygun ,  Kevin J. Doran ,  Yidnekachew S. Mekonnen

IPC分类号： H01L23/66 ,  H01L21/768

CPC分类号： H01L23/66 ,  H01L21/768 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/64 ,  H01L2223/6627 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01P3/08 ,  H05K1/0228 ,  H05K1/0248 ,  H05K1/0251 ,  H01L2924/0001

摘要： In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.

摘要翻译： 根据本说明书的一个方面，诸如微带线或带状线传输线的传输线具有短截线突起，其适于同时补偿由传输线和一条线之间的电感耦合引起的远端串扰（FEXT） 以及在传输线的远端处的垂直电互连和与相邻传输线电连接的相邻垂直电互连之间的电感耦合引起的远端串扰。 在本说明书的另一方面，微带传输线可以具有多个具有不同电阻和阻抗的短线部分，以逐渐从垂直互连（例如PTH通孔和插座连接器）的典型低阻抗特性逐渐转变。 描述其他方面。

公开(公告)号：US09515031B2

公开(公告)日：2016-12-06

申请号：US13976447

申请日：2011-12-29

申请人： Nevin Altunyurt ,  Kemal Aygun ,  Kevin J. Doran ,  Yidnekachew S. Mekonnen

发明人： Nevin Altunyurt ,  Kemal Aygun ,  Kevin J. Doran ,  Yidnekachew S. Mekonnen

IPC分类号： H01L23/66 ,  H01L21/768 ,  H01L23/64 ,  H01P3/08 ,  H05K1/02 ,  H01L23/498

CPC分类号： H01L23/66 ,  H01L21/768 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/64 ,  H01L2223/6627 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01P3/08 ,  H05K1/0228 ,  H05K1/0248 ,  H05K1/0251 ,  H01L2924/0001

摘要： In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.

摘要翻译： 根据本说明书的一个方面，诸如微带线或带状线传输线的传输线具有短截线突起，其适于同时补偿由传输线和一条线之间的电感耦合引起的远端串扰（FEXT） 以及在传输线的远端处的垂直电互连和与相邻传输线电连接的相邻垂直电互连之间的电感耦合引起的远端串扰。 在本说明书的另一方面，微带传输线可以具有多个具有不同电阻和阻抗的短线部分，以逐渐从垂直互连（例如PTH通孔和插座连接器）的典型低阻抗特性逐渐转变。 描述其他方面。