公开(公告)号：US10062820B2

公开(公告)日：2018-08-28

申请号：US15573088

申请日：2016-04-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mituhiko Ueda ,  Makoto Saito ,  Takanori Aketa ,  Toru Hirano

IPC: H01L33/00 ,  H01L33/62 ,  H01L23/14 ,  H01L33/60 ,  H01L23/00 ,  H01L33/44

CPC classification number: H01L33/62 ,  H01L23/147 ,  H01L23/32 ,  H01L23/49838 ,  H01L24/42 ,  H01L24/45 ,  H01L33/44 ,  H01L33/60 ,  H01L2224/14 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.