公开(公告)号：US20160007512A1

公开(公告)日：2016-01-07

申请号：US14768912

申请日：2014-02-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masayuki HIGASHI ,  Taisuke MORI ,  Ryouji KOUCHI ,  Takuya YAMAZAKI ,  Hisashi MAEZONO ,  Hiroshi ANDO

IPC: H05K13/00 ,  H05K13/04 ,  H05K3/30 ,  H05K13/02

CPC classification number: H05K13/0069 ,  B65G15/12 ,  B65G15/22 ,  B65G15/24 ,  H05K13/0061 ,  H05K13/085

Abstract: An electronic component mounting system includes a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The distribution control unit mixedly distributes the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.

Abstract translation: 一种电子部件安装系统，包括通过将组件安装单元互连而形成的部件安装线，其同时对安装工作量不同的两种板进行部件安装工作。 部件安装单元包括：第一和第二板传送机构; 部件安装单元; 板分配单元，其从上游侧装置接收板，并将接收板分配到第一板输送机构或第二板输送机构; 以及分配控制单元，其控制第一板输送机构，第二板输送机构和板分配单元。 分配控制单元基于从元件安装线中的最上游元件安装单元发出的板请求信号，将两种板混合地分配到第一和第二板输送机构中的每一个。