公开(公告)号：US20160029521A1

公开(公告)日：2016-01-28

申请号：US14807970

申请日：2015-07-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Taisuke MORI ,  Kenji KAMAKURA ,  Hideaki KATO

IPC: H05K13/04 ,  H05K13/02

CPC classification number: H05K13/0417 ,  H05K13/0419 ,  H05K13/081

Abstract: A component mounting apparatus includes a component supply device that intermittently feeds a carrier tape, in which components are stored in a plurality of pockets formed with a uniform pitch, based on a predetermined feed pitch to supply the components stored in the pockets to a component suction position, and picks up the components supplied to the component suction position to mount the components onto a board, an imaging unit that images the pockets, and a control unit that measures a formation pitch of the pockets based on obtained image data, and changes a feed pitch of the carrier tape from the predetermined feed pitch to the formation pitch of the pockets when the measured formation pitch of the pockets and the predetermined feed pitch are different from each other, and the component supply device intermittently feeds the carrier tape based on the changed feed pitch.

Abstract translation: 一种部件安装装置，包括一个部件供给装置，该部件供给装置基于预定的进给间距间歇地供给载带，其中将部件存储在形成有均匀节距的多个凹穴中，以将存储在凹穴中的部件供应到部件吸力 位置，并拾取提供给部件吸引位置的部件以将部件安装到板上，成像单元对凹坑进行成像;以及控制单元，其基于获得的图像数据来测量袋的形成间距，并且改变 当测量的凹坑的形成间距和预定进给间距彼此不同时，载带的进给间距从预定进给间距到凹穴的形成间距，并且部件供应装置基于 改变饲料间距。

公开(公告)号：US20160007512A1

公开(公告)日：2016-01-07

申请号：US14768912

申请日：2014-02-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masayuki HIGASHI ,  Taisuke MORI ,  Ryouji KOUCHI ,  Takuya YAMAZAKI ,  Hisashi MAEZONO ,  Hiroshi ANDO

IPC: H05K13/00 ,  H05K13/04 ,  H05K3/30 ,  H05K13/02

CPC classification number: H05K13/0069 ,  B65G15/12 ,  B65G15/22 ,  B65G15/24 ,  H05K13/0061 ,  H05K13/085

Abstract: An electronic component mounting system includes a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The distribution control unit mixedly distributes the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.

Abstract translation: 一种电子部件安装系统，包括通过将组件安装单元互连而形成的部件安装线，其同时对安装工作量不同的两种板进行部件安装工作。 部件安装单元包括：第一和第二板传送机构; 部件安装单元; 板分配单元，其从上游侧装置接收板，并将接收板分配到第一板输送机构或第二板输送机构; 以及分配控制单元，其控制第一板输送机构，第二板输送机构和板分配单元。 分配控制单元基于从元件安装线中的最上游元件安装单元发出的板请求信号，将两种板混合地分配到第一和第二板输送机构中的每一个。

公开(公告)号：US20150271925A1

公开(公告)日：2015-09-24

申请号：US14629678

申请日：2015-02-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Taisuke MORI ,  Masayuki HIGASHI

IPC: H05K3/30

CPC classification number: H05K13/0452 ,  H05K13/085 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: A component mounting unit includes first and second board conveyance mechanisms, first and second component supply units, and first and second component mounting mechanisms, for performing a component mounting work on a front surface and a rear surface of boards of a same type in parallel. Electronic components of all kinds to be mounted on the front surface and the rear surface at the component mounting unit are distributed to the first and second component supply units. The first and second component mounting mechanisms pick up electronic components from the first and second component supply unit, respectively. The first component mounting mechanism mounts the electronic component on the board held by each of the first and second board conveyance mechanisms. The second component mounting mechanism mounts the electronic component on the board held by each of the first and second board conveyance mechanisms.

Abstract translation: 部件安装单元包括第一和第二板传送机构，第一和第二部件供应单元以及用于在相同类型的板的前表面和后表面上并行执行部件安装工作的第一和第二部件安装机构。 要安装在部件安装单元的前表面和后表面上的各种电子部件被分配到第一和第二部件供应单元。 第一和第二部件安装机构分别从第一和第二部件供应单元拾取电子部件。 第一部件安装机构将电子部件安装在由第一和第二板传送机构中的每一个保持的板上。 第二部件安装机构将电子部件安装在由第一和第二板传送机构中的每一个保持的板上。