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1.发明授权Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method 有权粘贴转印单元，电子元件安装装置和转印膜厚度测量方法公开(公告)号：US09285204B2
公开(公告)日：2016-03-15
申请号：US14655593
申请日：2013-12-19
Inventor： Masanori Ikeda , Yousuke Hassaku , Satoshi Furuichi , Masahiro Taniguchi , Michinori Tomomatsu
CPC classification number: G01B7/06 , B23K1/0016 , B23K3/0638 , G01B11/0616 , H01L24/13 , H01L24/75 , H01L24/81 , H01L2224/11822 , H01L2224/13101 , H01L2224/7515 , H01L2224/759 , H01L2224/81011 , H05K1/0269 , H05K3/3484 , H05K13/0465 , H01L2924/014 , H01L2924/00014
Abstract: To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.
Abstract translation: 为了测量作为形成在糊剂转印单元（7）的转印台（24）上的粘合剂的焊剂（25）的涂膜（25a）的膜厚度，涂膜（25a）的膜厚度 通过光干涉法的光透射部件（51）和布置在转印台（24）的下方的光学型膜厚测量传感器（53）测量转印区域（26）。 因此，可以在传送区域（26）中自动且精确地测量焊剂（25）的膜厚度，而不需要任何复杂的测量工作。
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2.发明申请PASTE TRANSFER UNIT, ELECTRONIC COMPONENT MOUNTING DEVICE, AND TRANSFERRED FILM THICKNESS MEASURING METHOD 有权糊料转移单元，电子元件安装装置和转印薄膜厚度测量方法公开(公告)号：US20150345930A1
公开(公告)日：2015-12-03
申请号：US14655593
申请日：2013-12-19
Inventor： Masanori Ikeda , Yousuke Hassaku , Satoshi Furuichi , Masahiro Taniguchi , Michinori Tomomatsu
IPC: G01B7/06
CPC classification number: G01B7/06 , B23K1/0016 , B23K3/0638 , G01B11/0616 , H01L24/13 , H01L24/75 , H01L24/81 , H01L2224/11822 , H01L2224/13101 , H01L2224/7515 , H01L2224/759 , H01L2224/81011 , H05K1/0269 , H05K3/3484 , H05K13/0465 , H01L2924/014 , H01L2924/00014
Abstract: To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.
Abstract translation: 为了测量作为形成在糊剂转印单元（7）的转印台（24）上的粘合剂的焊剂（25）的涂膜（25a）的膜厚度，涂膜（25a）的膜厚度 通过光干涉法的光透射部件（51）和布置在转印台（24）的下方的光学型膜厚测量传感器（53）测量转印区域（26）。 因此，可以在传送区域（26）中自动且精确地测量焊剂（25）的膜厚度，而不需要任何复杂的测量工作。
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