公开(公告)号：US20240222302A1

公开(公告)日：2024-07-04

申请号：US18552746

申请日：2021-07-19

申请人： ORBOTECH LTD.

发明人： Zvi KOTLER ,  Ofer FOGEL ,  Sharona COHEN ,  Gil BERNSTEIN TOKER ,  Niv GORODESKY

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K1/005 ,  B23K3/047 ,  B23K3/06 ,  B23K3/08 ,  B23K101/40 ,  H01L21/66

CPC分类号： H01L24/11 ,  B23K1/0016 ,  B23K1/0056 ,  B23K3/047 ,  B23K3/0638 ,  B23K3/08 ,  H01L22/20 ,  H01L24/742 ,  B23K2101/40 ,  H01L2224/11318 ,  H01L2224/1183 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/742

摘要： A method for circuit fabrication includes inspecting an array of solder bumps on a circuit substrate so as to identify a solder bump having a height above the substrate that is greater than a predefined maximum. A first laser beam is directed toward the identified solder bump so as to ablate a selected amount of a solder material from the identified solder bump. Alternatively or additionally, a further solder bump having a height above the substrate that is less than a predefined minimum is identified, and one or more molten droplets of the solder material are deposited on the further solder bump. After ablating or depositing the solder material, a second laser beam is directed toward the identified solder bump with sufficient energy to cause the solder material in the identified solder bump to melt and reflow.

公开(公告)号：US20240217014A1

公开(公告)日：2024-07-04

申请号：US18543406

申请日：2023-12-18

申请人： Samsung Electronics Co., Ltd.

发明人： Seongchan HAN ,  Sangmyung LEE

IPC分类号： B23K3/06 ,  B23K3/08 ,  H05K3/12

CPC分类号： B23K3/0638 ,  B23K3/08 ,  H05K3/1216 ,  B23K2101/42

摘要： A solder printing apparatus including a printed circuit board feeding unit configured to sequentially feed a plurality of printed circuit boards, a solder paste printing unit configured to locate a solder mask on each of the printed circuit boards fed by the printed circuit board feeding unit and print solder paste on each of the printed circuit boards through an opening of the solder mask, a solder mask cleaning unit configured to clean residual solder from the solder mask after the solder paste is printed by the solder paste printing unit, and a control unit configured to control the solder paste printing unit and the solder mask cleaning unit, wherein the control unit is further configured to differently set a printing parameter of the solder paste printing unit for each of the printed circuit boards according to a cleaning cycle count set for the solder mask may be provided.

公开(公告)号：US11969829B2

公开(公告)日：2024-04-30

申请号：US18466024

申请日：2023-09-13

申请人： QUICK INTELLIGENT EQUIPMENT CO., LTD.

发明人： Fuke Qin ,  Qin Pan

IPC分类号： B23K3/00 ,  B23K3/06 ,  B23K31/02

CPC分类号： B23K3/0638 ,  B23K3/06 ,  B23K31/02

摘要： The embodiment of the present disclosure provides a welding device, a welding method, and an installation and debugging method thereof. The welding device includes a baseboard, comprising: a left welding nozzle and a right welding nozzle, a power shaft, a bidirectional moving wheel, and two welding nozzle connecting shafts, wherein the welding nozzle connecting shafts are connected to the left welding nozzle and the right welding nozzle respectively, and the bidirectional moving wheel which is driven by the power shaft drives the two welding nozzle connecting shafts to move towards or away from each other.

公开(公告)号：US20230415254A1

公开(公告)日：2023-12-28

申请号：US18466024

申请日：2023-09-13

申请人： QUICK INTELLIGENT EQUIPMENT CO., LTD.

发明人： Fuke QIN ,  Qin PAN

IPC分类号： B23K3/06 ,  B23K31/02

CPC分类号： B23K3/0638 ,  B23K31/02

摘要： The embodiment of the present disclosure provides a welding device, a welding method, and an installation and debugging method thereof. The welding device includes a baseboard, comprising: a left welding nozzle and a right welding nozzle, a power shaft, a bidirectional moving wheel, and two welding nozzle connecting shafts, wherein the welding nozzle connecting shafts are connected to the left welding nozzle and the right welding nozzle respectively, and the bidirectional moving wheel which is driven by the power shaft drives the two welding nozzle connecting shafts to move towards or away from each other.

公开(公告)号：US20230191519A1

公开(公告)日：2023-06-22

申请号：US17971776

申请日：2022-10-24

申请人： FUJI ELECTRIC CO., LTD.

发明人： Narumi SATO

IPC分类号： B23K3/06 ,  B23K3/08

CPC分类号： B23K3/0638 ,  B23K3/08 ,  B23K2101/40

摘要： To suppress waste of bonding material in a printing device. A printing device includes a dispenser, a squeegee, and a controller. The dispenser individually feeds bonding material to a plurality of apertures formed in a mask. The squeegee moves with an edge portion pressed against the mask and prints the bonding material fed to the apertures from the dispenser on a substrate. The controller drive-controls the dispenser and the squeegee.

公开(公告)号：US20180344245A1

公开(公告)日：2018-12-06

申请号：US16054366

申请日：2018-08-03

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC分类号： A61B5/00 ,  H05K3/40 ,  A61M5/00 ,  B23K3/06 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H01L23/00 ,  H01L23/66 ,  H01L23/538 ,  B23K101/36

CPC分类号： A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

摘要： An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.

公开(公告)号：US09883597B2

公开(公告)日：2018-01-30

申请号：US15100499

申请日：2013-12-05

申请人： FUJI MACHINE MFG. CO., LTD.

发明人： Akihiro Senga ,  Shoji Fukakusa ,  Ritsuo Hirukawa ,  Yoji Fujita ,  Yoshimune Yokoi

IPC分类号： B23K3/06 ,  H05K3/34 ,  B05C11/10 ,  B05C17/005 ,  B41F15/42 ,  B41F15/40 ,  H05K3/12 ,  B23K101/42

CPC分类号： H05K3/3468 ,  B05C11/1002 ,  B05C17/00533 ,  B23K3/06 ,  B23K3/0638 ,  B23K2101/42 ,  B41F15/40 ,  B41F15/405 ,  B41F15/42 ,  B41F15/423 ,  H05K3/1233

摘要： A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

公开(公告)号：US20170263498A1

公开(公告)日：2017-09-14

申请号：US15068002

申请日：2016-03-11

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Toyohiro Aoki ,  Akihiro Horibe ,  Kuniaki Sueoka ,  Kazushige Toriyama

IPC分类号： H01L21/768 ,  B23K3/08 ,  B23K3/04 ,  B23K3/06 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/76898 ,  B23K3/0607 ,  B23K3/0638 ,  H01L21/486 ,  H01L21/67103 ,  H01L21/67138 ,  H01L21/68757

摘要： A method for filling a through hole with solder includes mounting a substrate having a through hole formed therein on a permeable barrier layer having pores that enable gas to flow through the permeable barrier. A solder source is positioned over the through hole. Molten solder is delivered in the through hole with a positive pressure from the solder source such that gas in the through holes passes the permeable barrier while the molten solder remains in the through hole.

公开(公告)号：US09744612B2

公开(公告)日：2017-08-29

申请号：US15033232

申请日：2014-06-13

申请人： Senju Metal Industry Co., Ltd.

发明人： Tsutomu Hiyama ,  Yuta Saito

IPC分类号： B23K3/00 ,  B23K3/08 ,  B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  B23K3/06 ,  B23K35/362 ,  B01D47/06 ,  B01D47/16 ,  B01D53/26 ,  B23K101/42

CPC分类号： B23K3/08 ,  B01D47/06 ,  B01D47/16 ,  B01D53/265 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0638 ,  B23K3/0653 ,  B23K35/362 ,  B23K2101/42

摘要： A first water spray unit that sprays water into the gaseous mixture containing the flux component, a separation unit having an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flow component from the gaseous mixture.

公开(公告)号：US20170189981A1

公开(公告)日：2017-07-06

申请号：US15281687

申请日：2016-09-30

申请人： ERSA GmbH

发明人： Rainer KURTZ ,  Michael Schaefer

IPC分类号： B23K3/06 ,  H05K13/04 ,  B23K3/08

CPC分类号： B23K3/0638 ,  B23K1/085 ,  B23K3/0653 ,  B23K3/082 ,  B23K2101/42 ,  H05K3/34 ,  H05K13/0465

摘要： A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.