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公开(公告)号:US20250070499A1
公开(公告)日:2025-02-27
申请号:US18941222
申请日:2024-11-08
Applicant: Panduit Corp.
Inventor: Benjamin S. Novak , Satish I. Patel , Roman J. Churnovic
IPC: H01R13/506 , H01R13/28 , H01R13/659 , H01R24/84 , H01R31/06
Abstract: An electrical coupler has first and second housing halves and first and second contacts retained within the first and second housing halves. Wherein the first housing half is identical to the second housing half and the first contact is identical to the second contact.
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公开(公告)号:US20240151906A1
公开(公告)日:2024-05-09
申请号:US17983813
申请日:2022-11-09
Applicant: Panduit Corp.
Inventor: Satish I. Patel
IPC: G02B6/255
CPC classification number: G02B6/2558
Abstract: An optical connector houses and holds a fusion spliced portion with a short optical fiber fitted to an optical connector ferrule is fusion-spliced with a buffered optical fiber. One end of a protection sleeve which reinforces said fusion spliced portion is configured to be adhered to a buffer on the short optical fiber fitted to the optical connector ferrule and another end is adhered to a buffer of the buffered optical fiber. The protection sleeve has an inner heat shrink tube, an outer heat shrink tube, and at least one element that allows the protection sleeve to be concentric to the ferrule and cable buffer axis.
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公开(公告)号:US20220384999A1
公开(公告)日:2022-12-01
申请号:US17330740
申请日:2021-05-26
Applicant: Panduit Corp.
Inventor: David J. Papesh , Satish I. Patel
IPC: H01R13/6591 , H01R13/6583 , H01R24/86 , H01R13/6592
Abstract: An industrial connector has a cylindrical metal shield with at least one slot in the rear of the shield for engaging a cable braid. In one embodiment, the shield also has a cable relief cut out of the rear opposite the at least one slot.
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公开(公告)号:US10790616B2
公开(公告)日:2020-09-29
申请号:US16458388
申请日:2019-07-01
Applicant: Panduit Corp.
Inventor: Joshua A. Valenti , Sean W. Lenz , Paul W. Wachtel , Robert E. Fransen , Satish I. Patel
IPC: H01R13/6461 , H01R24/64 , H01R13/26 , H01R13/6581 , H01R12/58 , H01R13/6466 , H01R107/00
Abstract: Disclosed herein are various communications systems allowing for multiple contacts points between plug contacts in a communications plug and plug interface contacts (PICs) in a communications jack. In some disclosed implementations, a communications plug including a first and a second plug contact mated with a communications jack having a first and a second plug PIC may form a plurality of plug/jack interfaces. The plug/jack interfaces may form multiple current paths between the communications plug and the communications jack. When a signal propagates between the communications plug and the communications jack, it may be split in the communications plug between a first current path and a second current path, and recombined in the communications jack after traveling through the plurality of plug/jack interfaces.
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公开(公告)号:US10665993B2
公开(公告)日:2020-05-26
申请号:US16433366
申请日:2019-06-06
Applicant: Panduit Corp.
Inventor: Jason O'Young , Satish I. Patel , Joshua A. Valenti , Paul W. Wachtel , Robert E. Fransen , Andrew Ciezak , Michael B. Verbeek
IPC: H01R13/6461 , H01R13/62 , H01R13/6581 , H01R12/62 , H01R13/639 , H01R13/6582 , H01R24/64 , H01R13/627 , H01R13/6466 , H01R13/6469 , H01R107/00
Abstract: Embodiments of the present invention relate to the field of telecommunication, and more specifically, to communication connectors such as, for example, shielded plug and jack connectors. In an embodiment, the present invention is a communication jack that includes a housing and a front sled assembly having a plurality of plug interface contacts (PICs), the front sled assembly being moveable along a horizontal plane of the communication jack between a first position and a second position, the first position being different from the second position.
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公开(公告)号:US10522947B2
公开(公告)日:2019-12-31
申请号:US16032665
申请日:2018-07-11
Applicant: Panduit Corp.
Inventor: Satish I. Patel , Roman J. Churnovic , Jean de Deiu Mutangana
IPC: H01R13/6464 , H01R24/64 , H01R13/6461 , H01R13/6466 , H01R13/6469
Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
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公开(公告)号:US20190190191A1
公开(公告)日:2019-06-20
申请号:US16275501
申请日:2019-02-14
Applicant: Panduit Corp.
Inventor: Keith S. Maranto , Satish I. Patel , Robert E. Fransen , Michael G. Dragisic, JR.
IPC: H01R13/58 , H01R4/2404 , H01R24/64
CPC classification number: H01R13/5825 , H01R4/2404 , H01R13/5829 , H01R24/64 , H01R2201/04
Abstract: A communications plug is described. The communications plug includes a plug housing and a cable manager partially enclosed within the plug housing. The cable manager has a first cable management section and a second cable management section connected to opposing ends of a bridge section. The first and second cable management sections are configured to fold together along at least one longitudinal axis of the cable manager around a portion of the cable before the cable manager is inserted into the plug housing.
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公开(公告)号:US20180269638A1
公开(公告)日:2018-09-20
申请号:US15913059
申请日:2018-03-06
Applicant: Panduit Corp.
Inventor: Joshua A. Valenti , Sean W. Lenz , Andrew Ciezak , Paul W. Wachtel , Robert E. Fransen , Satish I. Patel
IPC: H01R24/64 , H01R12/58 , H01R13/6594
Abstract: Various implementations of communications connectors are disclosed. In some implementations, a communications connector, such as a communications plug, may include a plug body and a termination sled positioned at least partially in the plug body. The termination sled may include a printed circuit board (PCB) having a front section, a rear section, and a connecting section connecting the front section and the rear section. In some implementations, a communications cord may include a communications plug having a conductive shell and PCB assembly. The PCB assembly may include a PCB, front and rear load bars, and a shielded divider.
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9.
公开(公告)号:US09800005B2
公开(公告)日:2017-10-24
申请号:US15187996
申请日:2016-06-21
Applicant: Panduit Corp.
Inventor: Robert E. Fransen , Satish I. Patel , Joshua A. Valenti , Tse-Yu Lin , Moulik Shah
IPC: H01R24/00 , H01R27/00 , H01R13/6461 , H01R24/64 , H01R13/6467 , H01R107/00
CPC classification number: H01R27/00 , H01R13/6461 , H01R13/6467 , H01R24/64 , H01R2107/00 , H01R2201/04
Abstract: The present invention generally relates to communication connectors and internal components thereof. In one embodiment, the present invention is a communication jack comprising both front-rotated and back rotated plug interface contacts. In another embodiment, the present invention is a communication jack comprising a two-piece front sled. In yet another embodiment, the present invention is a communication jack that retains its functionality when mated with both eight-position and six-position plugs.
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公开(公告)号:US20170302029A1
公开(公告)日:2017-10-19
申请号:US15469903
申请日:2017-03-27
Applicant: Panduit Corp.
Inventor: Satish I. Patel , Roman J. Churnovic , Jean De Dieu Mutangana
IPC: H01R13/6464 , H01R24/64
CPC classification number: H01R13/6464 , H01R13/6461 , H01R13/6466 , H01R13/6469 , H01R24/64
Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
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