FUSION SPLICED OPTICAL CONNECTOR
    2.
    发明公开

    公开(公告)号:US20240151906A1

    公开(公告)日:2024-05-09

    申请号:US17983813

    申请日:2022-11-09

    Applicant: Panduit Corp.

    Inventor: Satish I. Patel

    CPC classification number: G02B6/2558

    Abstract: An optical connector houses and holds a fusion spliced portion with a short optical fiber fitted to an optical connector ferrule is fusion-spliced with a buffered optical fiber. One end of a protection sleeve which reinforces said fusion spliced portion is configured to be adhered to a buffer on the short optical fiber fitted to the optical connector ferrule and another end is adhered to a buffer of the buffered optical fiber. The protection sleeve has an inner heat shrink tube, an outer heat shrink tube, and at least one element that allows the protection sleeve to be concentric to the ferrule and cable buffer axis.

    Communication connectors utilizing multiple contact points

    公开(公告)号:US10790616B2

    公开(公告)日:2020-09-29

    申请号:US16458388

    申请日:2019-07-01

    Applicant: Panduit Corp.

    Abstract: Disclosed herein are various communications systems allowing for multiple contacts points between plug contacts in a communications plug and plug interface contacts (PICs) in a communications jack. In some disclosed implementations, a communications plug including a first and a second plug contact mated with a communications jack having a first and a second plug PIC may form a plurality of plug/jack interfaces. The plug/jack interfaces may form multiple current paths between the communications plug and the communications jack. When a signal propagates between the communications plug and the communications jack, it may be split in the communications plug between a first current path and a second current path, and recombined in the communications jack after traveling through the plurality of plug/jack interfaces.

    Communication jack having a dielectric film between plug interface contacts

    公开(公告)号:US10522947B2

    公开(公告)日:2019-12-31

    申请号:US16032665

    申请日:2018-07-11

    Applicant: Panduit Corp.

    Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

    COMMUNICATION CONNECTORS AND COMPONENTS THEREOF

    公开(公告)号:US20180269638A1

    公开(公告)日:2018-09-20

    申请号:US15913059

    申请日:2018-03-06

    Applicant: Panduit Corp.

    Abstract: Various implementations of communications connectors are disclosed. In some implementations, a communications connector, such as a communications plug, may include a plug body and a termination sled positioned at least partially in the plug body. The termination sled may include a printed circuit board (PCB) having a front section, a rear section, and a connecting section connecting the front section and the rear section. In some implementations, a communications cord may include a communications plug having a conductive shell and PCB assembly. The PCB assembly may include a PCB, front and rear load bars, and a shielded divider.

    COMMUNICATION JACK HAVING A DIELECTRIC FILM BETWEEN PLUG INTERFACE CONTACTS

    公开(公告)号:US20170302029A1

    公开(公告)日:2017-10-19

    申请号:US15469903

    申请日:2017-03-27

    Applicant: Panduit Corp.

    Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

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